WMSIC Electronic Components

HF HFD23/005-1ZS HFD23

ModelHFD23/005-1ZS
PackageDIP,12.5x7.5mm
BrandHF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HF HFD23 / 005-1ZS
Type
HF
Minimum package
1000

Technical parameters

Electronic Component
HF
Electronic Component
HFD23/005-1ZS
Electronic Component
1
Electronic Component
7.5mm
Package
DIP,12.5x7.5mm
Electronic Component
Signal Relay
Electronic Component
3g
Electronic Component
12.5mm
Electronic Component
6
Electronic Component
1
Electronic Component
5ms
Electronic Component
BM0228575335
Operating Temperature
40℃~+70℃
Contact Resistor
100mΩ
Coil Voltage
5V
Coil Resistor
167Ω

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HFD23/005-1ZS 产品概述

HFD23/005-1ZS 是宏发(HF)出品的一款小型信号继电器,标准 6 引脚 DIP 封装(外形约 12.5 × 7.5 × 10 mm),线圈电压 5 VDC,SPDT(单刀双掷)触点形式。该继电器面向一般信号切换与低功率控制场景,体积小、驱动功耗低、触点采用 AgNi+镀金,适合用于通信、测量、控制与自动化等对开关质量与可靠性有要求的场合。

一、主要特点

  • 小体积、轻量:典型尺寸 12.5 × 7.5 × 10 mm,适合密排布板设计。
  • 低功耗线圈:额定线圈功率 150 mW,线圈电阻 167 Ω,线圈电压 5 VDC(线圈电流约 30 mA),易于驱动。
  • 快速响应:动作时间 ≈ 5 ms,释放时间 ≈ 5 ms,适合一般信号切换响应要求。
  • 可靠触点材料:AgNi 合金触点并镀金处理,兼顾耐擦拭性能与低电阻,利于低电流/低电平信号传输。
  • 多种电气等级:最大切换电流可达 2 A(短时或特殊工况),推荐的常规电阻性负载能力:1 A @ 30 VDC;500 mA @ 125 VAC。最大允许切换电压:60 VDC / 125 VAC。
  • 宽温度范围:工作温度 -40 ℃ ~ +70 ℃,适应多数工业环境。

二、主要技术参数(概要)

  • 型号:HFD23/005-1ZS
  • 线圈电压:5 VDC
  • 线圈电阻:167 Ω(典型)
  • 额定线圈功率:150 mW(约 30 mA)
  • 触点形式:SPDT(单刀双掷)
  • 触点材料:AgNi + 镀金
  • 触点电阻:典型 100 mΩ
  • 触点容量(电阻负载):1 A @ 30 VDC;0.5 A @ 125 VAC
  • 最大切换电流:2 A(短时/特定条件)
  • 最大切换电压:60 VDC;125 VAC
  • 动作/释放时间:约 5 ms / 5 ms
  • 引脚数:6(DIP)
  • 工作温度:-40 ℃ ~ +70 ℃
  • 尺寸(参考):12.5 × 7.5 × 10 mm

(注:更多详细机械尺寸、引脚排列与寿命数据请以厂家数据手册为准。)

三、电气性能说明与使用注意

  • 线圈驱动:5 VDC、线圈电阻 167 Ω,线圈电流约 30 mA,单个 MCU GPIO 通常无法直接驱动,建议使用低功耗晶体管或驱动器。
  • 反向峰值管理:直流线圈通电/断电会产生反向电压,驱动器处应并联整流二极管(或二极管 + RC、TVS)来吸收反向峰值,以保护驱动器与减小电磁干扰。
  • 触点负载:对直流或感性负载(电机、继电器线圈、感性传感器等)应进行抑制(RC、TVS、续流二极管等),避免产生电弧或过高的触点磨损。
  • 低电平信号:触点镀金处理有利于低电流/低电压下的可靠接触,但长期接触污染仍需注意,建议在关键低电平应用中进行冗余或定期检测。

四、机械与封装

  • 标准 6 引脚 DIP 安装,适用于通孔焊接的 PCB 设计及自动插拔模块结构。
  • 小尺寸便于在空间受限的设备中并排布置多个继电器。
  • 安装与焊接建议参考宏发官方数据手册,遵循标准通孔焊接工艺,避免超过推荐的峰值温度与总加热时间以防损伤密封与接触镀层。

五、典型应用

  • 继电器矩阵与信号切换:测试设备、开关矩阵、通信端口切换。
  • 低功率控制:传感器供电切换、小型电子模块的电源/信号隔离。
  • 仪表与测量:低电平信号切换、自动化测试系统(ATE)内的通道选择。
  • 消费电子与安防设备:小型开关、控制逻辑隔离等。

六、使用建议与常见电路

  • 驱动建议:使用 NPN 晶体管或 N 沟 MOSFET 作为开集电极/开漏驱动,基/栅极前串联适当限流电阻,线圈并联反向二极管(例如 1N4148、1N400x)或快速恢复二极管。
  • 抗干扰:在对外部长导线或感性负载切换时,在线路上并联 RC 抑制器、TVS 或光耦隔离可显著降低干扰与延长触点寿命。
  • 负载选择:按推荐的电阻性负载参数使用,若需切换更高电流或容性/感性负载,应选用更高等级继电器或在触点前加入适当的保护器件。

七、采购与存储建议

  • 购买时确认批次与数据手册版本,关键项目(触点材料、寿命、封装尺寸)以正式数据手册为准。
  • 储存时避免潮湿、高温和腐蚀性气体,长期储存建议密封、防潮包装并保持清洁,防止触点污染与氧化。

如果需要我可以基于您的 PCB 布局提供建议的引脚排列与 PCB 钻孔尺寸参考,或给出一份典型驱动电路图(含反向二极管与限流元件)供设计参考。

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