WMSIC Electronic Components

HF HF49FD/005-1H12T HF49FD

ModelHF49FD/005-1H12T
PackageSIP,20x5mm
BrandHF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HF HF49FD / 005-1H12T
Type
HF
Minimum package
100 管装

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HF
Electronic Component
HF49FD/005-1H12T
Electronic Component
1
Electronic Component
5mm
Package
SIP,20x5mm
Electronic Component
Power Relay
Electronic Component
3.6g
Electronic Component
20mm
Electronic Component
4
Electronic Component
1
Electronic Component
10ms
Electronic Component
BM0230657799
Operating Temperature
40℃~+85℃
Contact Resistor
100mΩ
Coil Voltage
5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HF49FD/005-1H12T 产品概述

一、产品简介

HF49FD/005-1H12T 是宏发(HF)推出的一款微型功率继电器(Miniature Power),封装为 SIP(20 × 5 mm),体积小、功耗低、驱动电流小,适合对空间和能耗有严格要求的电路。线圈额定电压为 5V,额定线圈功率 120 mW(线圈电阻 208 Ω),为无极性单线圈设计,方便微控制器直接或经驱动器件控制。

二、主要电气参数

  • 线圈电压:5 V
  • 线圈电阻:208 Ω(线圈电流约 24 mA)
  • 额定线圈功率:120 mW
  • 触点形式:一组常开(单刀单掷,SPST-NO)
  • 触点材料:AgSnO2
  • 触点容量(电阻负载):5 A @ 30 VDC;5 A @ 250 VAC
  • 最大切换电压:250 V AC / 30 V DC
  • 最大切换电流:5 A
  • 接触电阻:≤100 mΩ
  • 动作时间:约 10 ms;释放时间:约 5 ms

三、机械与环境特性

  • 引脚数:4(适用于通孔 PCB 安装)
  • 封装尺寸:20 × 5 mm(SIP)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 描述:Miniature Power,适合紧凑型电源管理和信号隔离应用

四、应用场景

  • 通信设备、仪表仪器中的电源或信号切换
  • 工业控制与自动化的小电流控制回路
  • 家用电器、安防系统的控制板
  • 需要低驱动电流、节能且占板面积小的场合

五、使用建议与注意事项

  • 线圈驱动:线圈为无极性,直流驱动时建议在驱动晶体管两端并联续流二极管或用 RC 抑制,保护驱动器件。线圈电流约 24 mA,可直接由 MCU 的 I/O 或通过小型驱动器驱动,但推荐使用驱动管以提高可靠性。
  • 负载特性:标称 5 A 为电阻性负载条件下的能力;对于感性或电感性负载(直流电机、继电器线圈等),开关产生的电弧会加速触点损耗,建议采取熄弧措施(RC 吸收、TVS、机械隔离或使用外部接触器/固态器件)。
  • 寿命与降额:为延长触点寿命,建议在实际应用中对标准额定值进行适当降额,尤其是直流大电流场合;关注制造商的寿命曲线以匹配使用频率。
  • 布局与焊接:SIP 四脚通孔安装,焊接时注意温度和时间,以免损伤封装或影响线圈特性。

六、优势总结

  • 体积小、SIP 封装适合高密度 PCB 布局
  • 低线圈功耗(120 mW),驱动电流小(约 24 mA),有利于节能设计
  • 触点材料为 AgSnO2,具有较好的开关耐久性和抗烧蚀能力
  • 适用电压范围广(最高 250 VAC / 30 VDC),适配多种交流/直流场景

如需更详细的机械图、引脚排列或寿命试验曲线,可参考宏发(HF)提供的产品规格书或联系供应商获取样品与测试数据。

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