Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HFD23/005-1ZP 是宏发(HF)出品的一款小型信号继电器,线圈电压 5VDC,单刀双掷(1C,SPDT)触点形式,标准 6 引脚 DIP 封装,外形尺寸约 12.5×7.5×10 mm。该继电器针对低功耗、空间受限的信号切换场合设计,兼顾可靠性与体积,适用于通信、测控、仪表及便携设备等对信号质量要求较高的应用。
该继电器为低功耗线圈(150 mW),驱动电流约 30 mA,适合用 MCU 或低功率驱动器控制,但建议使用开集电极/开漏级或驱动晶体管/MOSFET 驱动以提高可靠性并减轻 MCU 负担。由于为直流线圈,使用时应加装反向并联二极管或 RC 抑制网络以吸收线圈释放时的反向电压,保护驱动器和减少电磁干扰。切换负载时请严格遵守额定电压、电流,若存在感性负载或大冲击电流(如继电器驱动电机、灯泡等),应增加保护器件(吸收器、浪涌抑制器)或选用更高容量继电器。
小巧的 12.5×7.5×10 mm 外形和 DIP 引脚形式,方便直接插装 PCB 或用于插座式焊接。动作与释放时间约 5 ms,满足快速响应的信号切换需要。AgNi + 镀金触点在低电流(mA 级)场合具有良好接触稳定性,同时对环境污染和氧化有一定抵抗力。工作温度范围 -40~+70 ℃,适应大多数工业与民用环境。
适用场景包括:通信设备线路切换、测试测量仪器信号路由、继电触点隔离的小电流开关、低功耗便携设备以及需要金属接触镀金以保证长期低电阻连接的场合。注意事项:
产品型号:HFD23/005-1ZP,品牌:HF(宏发)。封装形式:6 引脚 DIP,外形尺寸约 12.5×7.5×10 mm。下单时请确认线圈电压(5 VDC)、触点形式(1C SPDT)和所需数量。若需替代型号或更高容量/不同线圈电压的版本,可咨询供应商或查看 HF 系列继电器产品手册以获取匹配型号。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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