WMSIC Electronic Components

HF HFD4/3-S1R HFD4

ModelHFD4/3-S1R
PackageSMD,10x6.5mm
BrandHF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HF HFD4 / 3-S1R
Type
HF
Minimum package
900 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HF
Electronic Component
HFD4/3-S1R
Electronic Component
1
Electronic Component
6.5mm
Package
SMD,10x6.5mm
Electronic Component
Signal Relay
Electronic Component
1.1g
Electronic Component
10mm
Electronic Component
8
Electronic Component
1
Electronic Component
3ms
Electronic Component
BM0231132774
Operating Temperature
40℃~+85℃
Contact Resistor
100mΩ
Coil Voltage
3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HFD4/3-S1R 信号继电器 产品概述

HFD4/3-S1R 是宏发(HF)出品的一款小型 SMD 信号继电器,适用于空间受限且要求低驱动功率的开关应用。继电器采用 2C(双刀双掷/两组转换触点)8 引脚封装,封装尺寸仅约 10 × 6.5 mm,适合自动贴片装配与高密度 PCB 设计。以低电压低功耗驱动、金属合金触点和较快的动作响应为特征,可在通信、仪表、控制、消费电子等场景中充当信号级或微功率开关元件。

一、主要规格要点

  • 线圈电压:3 V(DC)
  • 额定线圈功率:140 mW
  • 线圈电阻:64.3 Ω(线圈电流约 46.6 mA)
  • 触点形式:两组转换(2C / 2PDT),引脚数:8
  • 触点容量(阻性负载):1 A @ 30 VDC;300 mA @ 125 VAC
  • 最大切换电压:250 V AC;220 V DC
  • 最大切换电流:2 A(取决于瞬态条件与厂商说明)
  • 触点材料:AgNi + 镀金(增强接触可靠性与抗氧化)
  • 接触电阻:≤ 100 mΩ
  • 动作/释放时间:约 3 ms / 3 ms
  • 线圈类型:有极性(单线圈)
  • 工作温度范围:-40 ℃ 到 +85 ℃
  • 封装形式:SMD,尺寸 10 × 6.5 mm
  • 品牌/型号:HF 宏发 / HFD4/3-S1R

二、性能特点

  • 低电压低功耗:3 V 线圈、约 140 mW 能耗,适合便携与低功耗系统。
  • 小型化 SMD 封装:适用于自动化贴片与高密度电路板布置,节省空间。
  • 金属合金触点并镀金处理:提高接触可靠性、降低接触电阻并延长微弱信号下的寿命。
  • 快速响应:约 3 ms 的操作与释放时间,适合需要快速切换的信号路径。
  • 宽工作温度:-40 ℃ 至 +85 ℃,适用于大多数工业及民用环境。

三、电气与驱动建议

  • 线圈驱动:线圈电阻 64.3 Ω,3 V 工作时电流约 46.6 mA,驱动器应能提供约 50 mA 的电流余量。可由低端 MOSFET、双向驱动器或小功率晶体管驱动。
  • 极性注意:线圈为有极性设计,接线时必须遵守厂商数据手册标注的极性;若需要外部抑制元件(如二极管或 RC 抑制器),应参考厂方建议以免影响内部极性结构或造成短路。
  • 触点保护:对于感性或高开关电压/电流负载,建议在被控回路添加 RC 吸收、TVS 或浪涌抑制,以减小电弧、延长触点寿命并避免干扰。
  • 接触容量与热应力:典型额定为 1 A@30 VDC / 300 mA@125 VAC;尽量在额定值内使用并考虑允许余量。短时冲击电流(例如 2 A 最大切换电流)需参考厂方条件说明,长期以额定负载为准。

四、封装与装配建议

  • PCB 布局:为保证可靠焊接与热疲劳性能,推荐遵循厂方提供的 PCB 焊盘布局与焊接孔位(请参见数据手册)。预留过孔或热阻断层以控制回流时的热量传导。
  • 回流焊接:作为 SMD 器件,建议采用标准无铅回流焊工艺并严格按厂方推荐的温度曲线(请以数据手册为准)进行,避免超温或超时导致结构损伤。
  • 清洗与化学稳定性:装配后清洗时慎用强腐蚀性溶剂,避免对触点镀层与密封结构造成影响。

五、典型应用场景

  • 通信设备:小信号切换、信号路径切换与测试点隔离。
  • 仪器仪表:量测切换、输入通道选择与线路切换。
  • 消费类与可穿戴设备:需要低功耗隔离开关的小型电子产品。
  • 汽车电子(非安全关键):在温度与振动条件许可下用于信号处理线路(应按汽车级要求验证)。

六、使用与选型注意事项

  • 请以最新厂方数据手册为准进行最终设计与可靠性评估,特别是关于最大切换次数、机械寿命、环境耐受能力与回流焊温度曲线的详细参数。
  • 对于关键或高电流应用,应选择与负载匹配的功率继电器或添加保护电路,避免长期在极限额定值附近工作。
  • 若需并联或冗余设计以提高寿命或承载能力,请咨询厂方技术支持以确认可行性与推荐接法。

产品型号:HFD4/3-S1R(HF 宏发)。如需数据手册、封装图或样品测试建议,请联系供应商或参考 HF 官方资料以获得完整技术信息与可靠性数据。

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