WMSIC Electronic Components

HF HF32F/012-HS3 HF32F

ModelHF32F/012-HS3
PackageThrough-hole, 18.4x10.2mm
BrandHF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HF HF32F / 012-HS3
Type
HF
Minimum package
100 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HF
Electronic Component
HF32F/012-HS3
Electronic Component
1
Electronic Component
10.2mm
Package
Through-hole, 18.4x10.2mm
Electronic Component
Power Relay
Electronic Component
5.87g
Electronic Component
18.4mm
Electronic Component
4
Electronic Component
1
Electronic Component
8ms
Electronic Component
BM0228575202
Operating Temperature
40℃~+70℃
Contact Resistor
100mΩ
Coil Voltage
12V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HF32F/012-HS3 产品概述

一、产品简介

HF32F/012-HS3 是宏发(HF)出品的一款小型插件功率继电器,单刀单掷常开(SPST-NO)触点配置,适合电阻性及轻中等感性负载的开关控制。封装为插件式,外形尺寸约 18.4 × 10.2 mm,适用于各类 PCB 插装场合,可靠性与通用性俱佳。

二、关键电气参数

  • 线圈电压:12V DC(无极性单线圈,接线无方向要求)
  • 线圈功率:450 mW,线圈电阻 320 Ω(标称电流约 37.5 mA)
  • 触点形式:一组常开(SPST-NO)
  • 触点材料:AgNi;接触电阻 ≤ 100 mΩ
  • 额定触点容量(电阻负载):5A @ 30VDC;5A @ 250VAC;10A @ 125VAC
  • 最大切换电流:10A;最大切换电压:250V AC / 30V DC
  • 动作/释放时间:约 8 ms / 5 ms
  • 工作温度范围:-40 ℃ ~ +70 ℃
  • 引脚数:4(插件式)

三、主要特性

  • 低线圈功耗(450 mW),便于在受限供电下驱动与多路并联使用。
  • 非极性线圈,装配和布线更为灵活。
  • AgNi 触点耐擦伤、导电稳定,适于较高开关次数的常规应用。
  • 紧凑封装,适合空间受限的 PCB 设计与模块化电源管理。

四、典型应用场景

  • 家电控制(灯光、风扇等)与工业控制小功率回路。
  • 仪器仪表、安防与通信设备中的电源切换与负载隔离。
  • 低压直流与交流线圈控制场合、继电器驱动模块或接口板。

五、设计与使用建议

  • 驱动方式:建议用晶体管或 MOSFET 驱动以降低 MCU 负担;线圈并联时注意总电流。
  • 抑制电路:若使用二极管吸收线圈反向电压,会延长释放时间;对需快速释放的场合可考虑 RC 或 TVS 等缓冲方案以兼顾速度与电磁干扰抑制。
  • 负载选择:在切换电感性负载(电机、继电器线圈等)时应考虑浪涌电流与触点电弧,必要时增加外部吸收与限流措施并适当选型余量。
  • 安装与焊接:遵循厂商推荐的 PCB 孔位和波峰/回流焊工艺,避免过高温度或长时间加热影响线圈与封装。

六、封装与采购注意

  • 产品为插件式封装,四脚布局便于快速更换与维护。外形尺寸约 18.4 × 10.2 mm,采购时请核对具体针脚排布与 PCB 尺寸图。
  • 选型时以实际工作电压、电流、负载类型和使用环境温度为准,必要时联系供应商获取产品寿命与耐久性详表以满足特殊行业需求。

如需电气特性曲线、典型接线图或 PCB 尺寸图,我可为您提供进一步资料与选型建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.