WMSIC Electronic Components

HF HF3FF/024-1HST HF3FF

ModelHF3FF/024-1HST
PackageThrough-hole, 19x15.2mm
BrandHF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HF HF3FF / 024-1HST
Type
HF
Minimum package
100 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HF
Electronic Component
HF3FF/024-1HST
Electronic Component
1
Electronic Component
15.2mm
Package
Through-hole, 19x15.2mm
Electronic Component
Power Relay
Electronic Component
8.182g
Electronic Component
19mm
Electronic Component
4
Electronic Component
1
Electronic Component
10ms
Electronic Component
BM0231132768
Operating Temperature
40℃~+85℃
Contact Resistor
100mΩ
Coil Voltage
24V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HF3FF/024-1HST 产品概述

一、产品简介

HF3FF/024-1HST 是宏发(HF)推出的一款小型插件式功率继电器,属于单刀单掷(SPST)常开触点配置(1A,常开)。该继电器外形紧凑(约19 × 15.2 mm),采用无极性单线圈设计,适用于需要低功耗控制、大电流开关能力以及空间受限的 PCB 插件应用。触点材料采用 AgSnO2,抗电弧和抗粘连性能良好,适合直流与交流电阻性负载切换。

二、主要性能参数

  • 触点形式:一组常开(1A,SPST-NO)
  • 触点材料:AgSnO2
  • 额定触点容量(电阻负载):10A @ 28VDC;10A @ 277VAC
  • 最大切换电流:15A(短时/瞬态允许值,实际寿命与负载特性相关)
  • 最大切换电压:28VDC;277VAC
  • 线圈电压:24V DC(标称)
  • 额定线圈功率:360 mW(低功耗)
  • 线圈电阻:约 1.6 kΩ(24V 时线圈电流约 15 mA)
  • 线圈类型:无极性(单线圈,可任意接入极性)
  • 动作时间:约 10 ms
  • 释放时间:约 5 ms
  • 接触电阻:≤ 100 mΩ(典型)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 引脚数:4(通常为线圈 2 + 触点 2)
  • 封装方式:插件(Through-hole),尺寸约 19 × 15.2 mm

该继电器以低线圈功耗(360 mW)和较高的触点额定电流为主要卖点,适合需要多路控制且驱动能力受限的系统。

三、设计与使用要点

  • 线圈驱动:24V DC 线圈电流约为 15 mA(24V/1.6kΩ),适合微控制器或低功耗驱动电路直接驱动(若需要可并联驱动晶体管提高隔离性)。
  • 无极性说明:本型号为无极性线圈,允许任一方向接入线圈两端。但若使用二极管做反向抑制器,则会引入极性限制并延长释放时间;若需兼顾快速释放和电压抑制,建议采用 RC 阻容吸收或双向 TVS 管等方式。
  • 触点使用:按额定值使用可以得到最佳寿命。对于感性负载或高冲击电流(如电机启动、灯泡)需评估浪涌电流对触点磨损的影响,必要时外接保护器件(吸收回路、限流、熔断器等)。
  • 热与环境:工作温度范围宽(-40~+85 ℃),但长时间高温或潮湿环境会影响触点寿命及可靠性,建议在设计中预留散热和防护措施。
  • 安装与焊接:为插件封装,建议使用符合厂家推荐的波峰焊或手工焊接工艺。实际焊接温度时间参数请参阅官方数据手册,避免因过热损伤线圈或密封结构。

四、典型应用场景

  • 工业控制:PLC 扩展输出、继电器逻辑隔离、小型执行机构控制。
  • 通讯与网络设备:电源切换、信号断开保护(使用适配的抑弧措施)。
  • 电源与配电:小功率电源切换、备用电源切换(DC 或 AC 电阻性负载)。
  • 家用电器与楼宇控制:风机、阀门驱动控制、照明回路(注意浪涌电流管理)。
  • 汽车电子(需确认车规认证与 ESD/EMC 要求):在 24V 系统中可用,但车用应参考专用车规件。

五、封装、引脚与安装信息

  • 封装类型:插件式(PCB through-hole),适合需要可靠机械连接的场合与多次更换维护。
  • 外形尺寸:约 19 × 15.2 mm(具体外形与安装孔位请参考机械尺寸图)。
  • 引脚数:4(通常为线圈 2 引脚,触点 2 引脚);安装时注意留足孔距和铜箔承载能力以应对 10A 额定电流。

六、注意事项与选型建议

  • 额定与最大值区别:请将 10A@28VDC 和 10A@277VAC 视为额定连续切换能力;15A 为短时允许的最大切换电流,频繁或长期超过额定值会显著降低触点寿命。
  • 抑弧与保护:对感性或高冲击负载推荐使用 RC、TVS 或其他抑制器件,以保护触点并延长寿命。若在固定极性系统中使用二极管做抑制,注意会延长释放时间。
  • 验证可靠性:在最终设计中建议进行实际负载的寿命测试(电寿命与机械寿命)、温升测试以及 EMI/ESD 验证。
  • 参考资料:为保证全部电气、机械和环境参数符合应用需求,请以官方规格书为准,并在关键应用上向供应商确认寿命与认证信息。

总结:HF3FF/024-1HST 以小巧体积、低线圈功耗与较高触点额定电流为特点,适合多种工业与民用控制场景。合理的抑弧与热管理设计可显著提升实用寿命和可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.