WMSIC Electronic Components

HF HFD27/024-M HFD27

ModelHFD27/024-M
PackageDIP,20.2x10.2mm
BrandHF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HF HFD27 / 024-M
Type
HF
Minimum package
25 管装

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HF
Electronic Component
HFD27/024-M
Electronic Component
1
Electronic Component
10.2mm
Package
DIP,20.2x10.2mm
Electronic Component
Signal Relay
Electronic Component
4.9g
Electronic Component
20.2mm
Electronic Component
1
Electronic Component
7ms
Electronic Component
BM0257490833
Operating Temperature
40℃~+85℃
Contact Resistor
100mΩ
Coil Voltage
24V
Coil Resistor
1.6kΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HFD27/024-M 功率继电器 产品概述

一、产品简介

HFD27/024-M 为宏发(HF)出品的小型功率继电器,采用标准DIP封装(尺寸约20.2 × 10.2 mm),适合于对体积、功耗和可靠性有要求的模拟/数字混合电路或信号切换场合。该器件为24V直流线圈驱动,触点采用AgNi基材并镀金处理,兼顾导电性能与耐久性,适合低至中等电压/电流的开关应用。

二、主要规格参数

  • 线圈额定电压:24 V DC
  • 额定线圈功率:280 mW(标称)
  • 线圈直流电阻:1.6 kΩ(标称)
  • 触点形式与材料:银镍合金(AgNi)+ 镀金
  • 触点容量(阻性负载):1 A @ 125 VAC;2 A @ 30 VDC
  • 最大切换电压:120 V DC;240 V AC
  • 最大切换电流:2 A
  • 接触电阻:≤100 mΩ(典型、测量条件相关)
  • 动作时间(Operate):约 7 ms
  • 释放时间(Release):约 4 ms
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装形式:DIP,外形尺寸约 20.2 × 10.2 mm

(注:线圈功率、线圈阻值与由此计算的电流在不同测试条件下可能有所差异,设计驱动电路时请预留一定裕量。)

三、产品特点

  • 小型化封装:DIP形式便于插装或波峰/回流焊后插件安装,适合集成到 PCB 模块化设计中。
  • 低功耗线圈:标称功率 280 mW,适合由 MCU 或低功耗驱动电路直接驱动(仍建议使用驱动晶体管或继电器驱动 IC)。
  • 良好触点可靠性:AgNi + 镀金工艺提高抗氧化能力与接触稳定性,适用于信号切换和低电压功率回路。
  • 快速响应:7 ms 动作与 4 ms 释放,满足多数控制和保护类切换需求。
  • 宽温区适应:-40 ℃ 至 +85 ℃ 的工作温度,适应工业级环境。

四、典型应用场景

  • 通信设备中的信号切换模块与保护回路。
  • 工业控制器、仪表中的低功率负载控制(如指示灯、信号级继电)。
  • 家电控制板中小电流开关应用。
  • 汽车电子(非安全关键高功率回路)、测试与测量设备的开关矩阵。

(对感性或高浪涌负载应采取额外保护,并在实际应用中验证寿命与可靠性。)

五、使用与安装要点

  • 驱动与抑制:作为直流线圈继电器,建议在驱动侧并联快速恢复二极管或 RC 抑制网络,以吸收线圈反向峰值、降低对驱动器的冲击。若在低延迟或双向电路中使用可选用瞬态抑制元件。
  • 负载类型:标称触点容量为阻性负载下的典型值;对感性负载(电机、继电器线圈等)或高浪涌负载需配合 RC/SNUBBER、TVS、齿轮或缓启动电路降低触点电弧。
  • PCB 布局:保持触点间、触点与线圈间足够的爬电/间隙距离,尤其在切换接近最大电压(120 V DC / 240 V AC)时。若有需通过相关安规认证,应遵守相应距规范。
  • 安装方向与散热:尽管功耗较低,仍建议在封装周围留有适当空间以利通风散热,避免在封装上方叠放热源。

六、可靠性与环境适应

HFD27/024-M 适用于工业级温度范围并采用抗氧化触点镀层,具备良好的环境适应性。实际寿命受负载类型、开关频率、工作电压及环境条件影响,建议在量产前进行应用环境下的电寿命和机械寿命测试,以确定维护周期与可靠性预期。

七、订购信息与封装

  • 品牌:HF(宏发)
  • 型号:HFD27/024-M
  • 封装:DIP(通孔安装),外形约 20.2 × 10.2 mm

如需批量采购或获取完整数据手册(包含引脚定义、典型电路、寿命曲线、介电强度等),建议联系供应商或厂家工程支持以获取最新认证与测试资料。

总结:HFD27/024-M 是一款小型、低功耗且适用于信号与中小功率开关场合的24V功率继电器,结合良好触点材料与工业温度等级,适合嵌入式控制与通信类设备中作为可靠的开关元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.