WMSIC Electronic Components

HF HF3FF/005-1HST HF3FF

ModelHF3FF/005-1HST
PackageThrough-hole, 19x15.2mm
BrandHF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HF HF3FF / 005-1HST
Type
HF
Minimum package
100 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HF
Electronic Component
HF3FF/005-1HST
Electronic Component
1
Electronic Component
15.2mm
Package
Through-hole, 19x15.2mm
Electronic Component
Power Relay
Electronic Component
6.52g
Electronic Component
19mm
Electronic Component
4
Electronic Component
1
Electronic Component
10ms
Electronic Component
BM0257267910
Operating Temperature
40℃~+85℃
Contact Resistor
100mΩ
Coil Voltage
5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HF3FF/005-1HST 产品概述

一、产品简介

HF3FF/005-1HST 是宏发(HF)公司推出的一款超小型大功率功率继电器,采用插件封装(尺寸约19×15.2mm),单刀单掷常开(SPST-NO)触点结构,适用于对体积有严格要求但需要较大开关容量的电子与电力控制应用。

二、主要电气参数

  • 线圈电压:5V DC(无极性单线圈)
  • 线圈电阻:70Ω,线圈电流约为71mA(5V/70Ω),额定线圈功率约360mW
  • 触点形式:一组常开(单刀单掷-常开)
  • 触点材料:AgSnO2(抗电弧、耐电擦伤)
  • 触点容量(电阻负载):10A @ 28VDC;10A @ 277VAC
  • 最大切换电流:15A
  • 最大切换电压:28VDC;277VAC
  • 接触电阻:≤100mΩ
  • 动作/释放时间:动作约10ms,释放约5ms
  • 引脚数:4(插件形式)
  • 工作温度:-40℃ ~ +85℃

三、产品特点

  • 小体积大功率:19×15.2mm 套件下仍能提供10A 等级的开关能力,便于高密度设计。
  • 低功耗线圈:360mW 额定功耗,驱动电流小,适合微控制器或低功耗驱动电路。
  • 无极性线圈:线圈对极性不敏感,布线更方便。
  • 优良触点材料:AgSnO2 提升耐电弧性与开关寿命,适合频繁开关场合。
  • 快速响应:动作/释放时间短,有利于精确控制与保护电路设计。

四、典型应用场景

  • 工业控制与PLC 输出扩展模块
  • 家用电器与厨房电器的电源切换
  • 安防与楼宇控制系统
  • 通讯设备的电源管理与负载切换(在额定条件下使用)
  • 电池管理与DC-DC 控制回路(注意电弧与抑制措施)

五、驱动与抑制建议

  • 驱动电流约71mA,直接由MCU 的驱动端口可能不足,建议用晶体管或驱动芯片驱动并带限流保护。
  • 线圈为无极性,但若使用有开关器件(如NPN、MOSFET)控制线圈,仍建议在驱动器两端并联二极管、TVS 或RC 抑制网络以降低反向电压与抑制干扰,选择抑制元件时需兼顾动作/释放时间要求。
  • 对于高电流切换(接近10A)建议在负载端加装适当的浪涌吸收或灭弧装置(如RC、SIRA、电感等),以延长触点寿命。

六、安装与注意事项

  • 插件封装,焊接和安装时请参考宏发的官方数据手册,遵循推荐的焊接温度曲线与机械应力限制。
  • 在高温、高湿或强振环境中使用前,请验证实际应用的可靠性与寿命数据(按厂家寿命试验为准)。
  • 对于安全关键或长寿命要求的系统,建议在设计阶段进行整机级的EMC 与热分析,合理安排散热与隔离。

如需更详细的机械尺寸、引脚排列图、寿命曲线与典型电气寿命数据,请参考宏发 HF 官方数据手册或联系供应商获取完整资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.