Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HF HF115F-A/230-1ZS3AF HF115F
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HF HF115F-A / 230-1ZS3AF
- Type
- HF
- Minimum package
- 50 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HF
- Electronic Component
- HF115F-A/230-1ZS3AF
- Electronic Component
- 1
- Package
- DIP,29x12.7mm
- Electronic Component
- Power Relay
- Electronic Component
- 12.1g
- Electronic Component
- 8
- Electronic Component
- 1
- Electronic Component
- BM0263471154
- Operating Temperature
- 40℃~+70℃
- Contact Resistor
- 100mΩ
- Coil Voltage
- 230V
- Coil Resistor
- 32.5kΩ
- Coil Type
- Coil
- Electronic Component
- Conversion: 1C
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HF115F-A/230-1ZS3AF 产品概述
一、基本特性
HF115F-A/230-1ZS3AF 是宏发（HF）出品的一款低高度、小体积功率继电器，线圈为230V AC（无极性单线圈），触点形式为一组转换（1C，单刀双掷），引脚数8。触点额定为16A（电阻性负载，250VAC），最大切换电压可达440VAC / 300VDC，触点材料为AgSnO2，接触电阻≤100mΩ。继电器在-40℃~+70℃环境下工作可靠，线圈电阻为32.5kΩ（线圈电流约7.1mA，线圈耗电约1.6W）。
二、绝缘与可靠性指标
该继电器线圈与触点之间耐压达5kV，爬电距离10mm，并满足VDE 0700、0631 的加强绝缘要求，符合IEC 60335-1家用电器安全标准，UL绝缘系统F级（155℃），并通过RoHS环保标准。产品提供带插座版本，且有塑封与防焊剂（防波峰焊/清洗）型号可选，便于装配与现场更换。
三、结构与安装
继电器为低高度封装（高度仅15.7mm），适合空间受限的电路板或模块化设计。标准8脚布局支持通过PCB或插座安装，插座化设计有利于维护与替换。塑料密封型可在潮湿或需洗板工艺的场景下使用，防焊剂/防波峰焊型号则提高了焊接可靠性。
四、触点与应用建议
AgSnO2触点材质抗电弧性能良好，相对耐焊接、延长使用寿命。但在感性负载（马达、电感性负载、整流电源、LED驱动等）切换时，应考虑触点电流冲击和电弧保护措施（如RC吸收器、压敏电阻、串联电阻或外接浪涌抑制装置）。对于长期大电流或频繁切换场景，请在设计时进行适当的电流与温升裕度评估并参考厂家寿命数据。
五、典型应用场景
- 家用电器（洗衣机、微波炉、热水器等）控制回路
- HVAC与空调系统的电源或控制切换
- 工业控制模块与楼宇自动化设备
- 电源管理、插座与照明控制（需考虑感性负载的抑制）
- 需要插座化维护或板上低高度设计的嵌入式系统
六、选型与使用注意
- 确认负载类型并对感性负载做电弧抑制与浪涌保护；16A为电阻性额定值，感性负载时请留裕量。
- 若需要洗板或潮湿环境，请选用塑封/防焊剂版本并使用对应插座；安装时保证爬电距离与散热条件。
- 线圈为AC无极性设计，接线无需区分极性；若需抑制干扰，可并联RC或MOV元件，注意选型与触点寿命的权衡。
- 在高温环境或靠近热源时，应按UL F级与实际温升评估使用寿命与可靠性。
总结：HF115F-A/230-1ZS3AF 在保持低高度与紧凑体积的同时，提供16A的大电流切换能力和良好的安全绝缘性能，适用于要求可靠开关与插座化维护的家电与工业控制领域。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
