Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HF HFD27/048-M HFD27
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HF HFD27 / 048-M
- Type
- HF
- Minimum package
- 25 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HF
- Electronic Component
- HFD27/048-M
- Electronic Component
- 1
- Electronic Component
- 10.2mm
- Package
- DIP,20.2x10.2mm
- Electronic Component
- Signal Relay
- Electronic Component
- 6.3g
- Electronic Component
- 20.2mm
- Electronic Component
- 16
- Electronic Component
- 1
- Electronic Component
- 7ms
- Electronic Component
- BM0257710342
- Operating Temperature
- 40℃~+85℃
- Contact Resistor
- 100mΩ
- Coil Voltage
- 48V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HFD27/048-M 功率继电器产品概述
一、概述
HFD27/048-M 为宏发（HF）出品的一款功率继电器，采用16引脚DIP型封装（具体外形尺寸未提供）。设计用于中低功率开关场合，触点采用AgNi并镀金处理，兼顾耐电弧能力与低电阻接触特性，适合于直流与交流信号及中小功率负载切换。
二、主要技术参数
- 线圈电压：48 V DC
- 线圈电阻：4 kΩ（标注）；额定线圈功率：280 mW（标注）——注：两项数据存在表面矛盾（详见下文）
- 引脚数：16（DIP）
- 触点容量（电阻负载）：1 A @ 125 VAC；2 A @ 30 VDC
- 最大切换电压：120 V @ DC；240 V @ AC
- 最大切换电流：2 A
- 触点材料：AgNi + 镀金
- 接触电阻：≤100 mΩ
- 动作/释放时间：约 7 ms / 4 ms
- 工作温度范围：-40 ℃ ～ +85 ℃
三、性能与特点
- 低功耗小型驱动：标称线圈功率为280 mW，便于在功率受限的系统中并联或多路驱动使用。
- 低接触电阻与镀金处理：接触电阻≤100 mΩ，镀金有利于低电平信号的可靠传输与抗氧化性能。
- 适用广泛：可同时满足交流125VAC和直流30VDC下的常见负载要求，最大直流120V的开关能力扩展了使用场景。
- 快速响应：动作7 ms、释放4 ms，适合多数控制与信号切换应用。
注意：标注线圈电阻4 kΩ与额定线圈功率280 mW彼此不完全匹配（若R=4 kΩ，则48 V情况下线圈功率约576 mW）。建议在设计前向供应商确认最终资料，以确定驱动电流与驱动电路元件规格。
四、典型应用
- 通信设备与继电保护模块
- 工业控制、继电器阵列与信号路由
- 仪器仪表中的直流/交流小功率开关
- 需要镀金触点以保证低电平可靠性的场合
五、使用与 PCB 布局建议
- DIP 16 封装通常为直插式，通过孔焊接为主，布局时预留足够散热与绝缘距离（高电压端与逻辑端保持安全间距）。
- 线圈端建议并联反向二极管或 TVS 抑制器以抑制反向电压尖峰，保护驱动器。
- 若实际负载接近触点上限（2 A），应考虑并联触点或使用带有更高容量的外部开关器件以延长寿命。
- 在低电平信号切换时，镀金触点可减少接触不良风险，但仍建议进行耐久测试以评估寿命。
六、检验与选型建议
- 在采购与设计前，务必索取并核对厂家完整数据手册，确认线圈电特性（电阻/额定功率/吸合保持电流）与引脚排列图。
- 对关键项目进行样机实测：接触电阻、开关耐久性（机械与电气寿命）、在额定温度范围内的工作稳定性等。
- 根据系统需要考虑冗余与保护电路（熔断、限流、吸收元件），以提高可靠性与安全性。
如需我帮忙核对具体数据手册、计算驱动电路参数或给出PCB封装建议，请提供供应商原始数据页或外形图。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
