WMSIC Electronic Components

HF HF3FF/024-1ZTF HF3FF

ModelHF3FF/024-1ZTF
PackageThrough-hole, 15.2x19mm
BrandHF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HF HF3FF / 024-1ZTF
Type
HF
Minimum package
100 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HF
Electronic Component
HF3FF/024-1ZTF
Electronic Component
1
Package
Through-hole, 15.2x19mm
Electronic Component
Power Relay
Electronic Component
7.73g
Electronic Component
5
Electronic Component
1
Electronic Component
10ms
Electronic Component
BM0257490838
Operating Temperature
40℃~+85℃
Contact Resistor
100mΩ
Coil Voltage
24V
Coil Resistor
1.6kΩ
Coil Type
Coil

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HF3FF/024-1ZTF 产品概述

一、产品简介

HF3FF/024-1ZTF 为宏发(HF)出品的一款超小型大功率24V 单刀双掷(1C,SPDT)功率继电器,采用插件封装,外形尺寸仅 15.2 × 19 mm,5 引脚设计,适合密集布板和空间受限的应用场景。此继电器以低线圈功耗、快速动作和耐电弧触点材料为特色,适用于各种工业控制、通讯设备、电源管理和家电等领域。

二、主要参数(概要)

  • 型号:HF3FF/024-1ZTF
  • 线圈电压:24 V DC(无极性单线圈)
  • 线圈功率:360 mW(典型)
  • 线圈电阻:1.6 kΩ(典型) → 线圈电流约 15 mA(24 V / 1.6 kΩ)
  • 触点形式:1C(单刀双掷,转换)
  • 引脚数:5(插件)
  • 触点材料:AgSnO2(银锡氧化物合金)
  • 接触电阻:≤100 mΩ(典型)
  • 动作时间:10 ms(典型)
  • 释放时间:5 ms(典型)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:插件,外形 15.2 × 19 mm
  • 品牌:HF(宏发)

三、性能亮点与材料优势

  • 低线圈功耗:360 mW 的线圈功耗和约 15 mA 的驱动电流,可降低系统能耗,便于电池或低功耗控制器驱动(建议通过驱动器件或晶体管隔离控制)。
  • 无极性线圈:线圈为无极性设计,接线方向不敏感,便于安装与更替。需要注意:若采用单向二极管做浪涌抑制,会使线圈变为有极性,若需保持无极性建议采用 RC 吸收网络或双向 TVS 等抑制方式。
  • AgSnO2 触点:银锡氧化物触点在耐电弧、抗焊接及开关寿命方面表现良好,适合开关感性负载或有冲击电流的场合。
  • 快速响应:典型动作时间 10 ms,释放时间 5 ms,适合需要较快切换的控制系统。

四、推荐使用与保护措施

  • 驱动建议:尽管线圈电流低(约 15 mA),仍建议通过驱动晶体管(NPN/PNP 或 MOSFET)或继电器驱动器件控制,以实现良好隔离及保护微控制器 IO。
  • 抑制方案:推荐使用 RC 吸收网络(例如 R 与 C 组合)或双向 TVS、RC+磁珠 等非极性抑制器件,避免直接并联单向二极管(若并联二极管则继电器线圈将具有极性)。
  • 焊接与安装:插件封装适合波峰或手工焊接,焊接时注意温度和时间控制,避免长期高温造成线圈或绝缘材料退化。焊接清洗应避免强腐蚀性溶剂长时间接触触点区域。
  • 负载注意:本概述未包含具体触点额定电流/电压,请在设计前查阅完整型号 Datasheet 确认最大开关电流、电压及机械/电气寿命等详细指标,特别是高电流或感性负载场合应评估触点寿命与防弧措施。

五、典型应用

  • 工业控制继电与信号切换
  • 通讯设备电源切换和保护
  • 仪表及测控系统中小功率负载控制
  • 家电控制模块、智能插座等对空间和功耗要求较高的应用场景

六、可靠性与环境适应

HF3FF/024-1ZTF 设计满足 -40 ℃ 到 +85 ℃ 的宽温度范围,适合户内外复杂环境使用。触点材料与快速动作特性有利于提高电气寿命与切换稳定性。建议在关键应用中依据实际工作条件做加速寿命试验与环境应力测试,以验证长期可靠性。

如需进一步的电气特性(触点额定容量、绝缘电阻、耐压、寿命次数等)、引脚排列图与 PCB 封装尺寸,请参阅宏发 HF 官方 Datasheet 或提供样品进行评估测试。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.