Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM1117S-3.3 是一款由 HTC 公司生产的线性稳压器(LDO),采用封装形式为 SOT-223。该器件能够提供固定输出电压为 3.3V 的稳压功能,最大输出电流可达 1A,广泛应用于电子设备中的电源管理解决方案。LM1117 系列稳压器以其卓越的性能和高度的稳定性,成为了许多电子设计工程师的首选。
固定输出电压 : LM1117S-3.3 提供稳定的3.3V 输出,特别适用于需要低压电源的应用,例如微控制器、传感器和外围设备等。
输入电压范围 : 该稳压器支持相对宽广的输入电压范围,通常在 4.75V 至 15V 之间,方便在多种电源环境下工作。
输出电流 : LM1117S-3.3 的最大输出电流可以达到 1A,使得开发者能够驱动多种负载,包括小型马达和LED等。
低压差特性 : 此稳压器具有低压差(Low Dropout,LDO)特性,输出电压与输入电压之间的差值可低至 1.2V,意味着在低输入电压条件下仍能有效工作,从而提高系统的能效。
兼容性和标称温度性能 : LM1117S-3.3 操作温度范围广泛,工作温度可达到 -40°C 到 +125°C,适合各种工业和消费电子应用。
焊接友好型封装 : SOT-223 封装设计小巧,助力 PCB 布局优化,适宜用于空间有限的设计。
LM1117S-3.3 的应用领域非常广泛,主要包括:
在使用 LM1117S-3.3 时,设计人员需要注意以下几点:
LM1117S-3.3 是一款高性能的线性稳压器,它以高稳定性、低压差以及合理的输出能力,满足了多种应用场合的需求。其 SOT-223 封装设计小巧,适合现代电子设备对空间的严格要求。无论是在消费电子、工业控制还是通信设备中,LM1117S-3.3 都能够提供可靠且高效的电源解决方案,是电子设计领域一款不可或缺的重要元件。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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