Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HOLTEK HT7590-3 HT7590
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HOLTEK(Holtek / Holtek) HT7590-3
- Type
- SOT-89-3
- Minimum package
- 1000 个
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 25mV@(1mA)
- Electronic Component
- HOLTEK(Holtek / Holtek)
- Electronic Component
- HT7590-3
- Electronic Component
- 1
- Package
- SOT-89-3
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.041g
- Electronic Component
- 1
- Electronic Component
- BM0228787399
- Operating Temperature
- 40℃~+85℃@(Ta)
- Operating Voltage
- 30V
- Output
- Electronic Component
- Output Voltage
- 9V
- Output Current
- 150mA
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HT7590-3 产品概述
一、产品简介
HT7590-3 是台湾 HOLTEK（合泰/盛群）推出的一款固定输出线性稳压器（LDO），输出固定为正极 9V。器件采用 SOT-89-3 小封装，面向对静态电流与电源稳定性有较高要求的便携或嵌入式系统。工作环境温度范围为 -40℃ 至 +85℃（Ta），适合工业级常温应用。
二、主要规格与性能
- 输出电压：9V（固定）
- 工作电压上限：30V（最大输入）
- 输出电流：最大 150mA
- 静态电流（Iq）：典型 1µA（超低静态电流，利于电池供电场景）
- 压差：25mV @ 1mA（低压差，在轻载时具有很小的输入-输出电压差）
- 输出通道数：1（单通道）
- 封装：SOT-89-3
三、优势与设计要点
- 极低静态电流（1µA）非常适合待机功耗受限的电池供电设备，可显著延长待机时间。
- 低压差特性在轻载工况下可减少输入电压要求，提高效率（但在大电流时压差会增加，应参照器件规格曲线）。
- 单通道 150mA 的输出能力适合为小型模拟电路、MCU 外设或传感器供电。
四、热管理与功耗估算
线性稳压器的功耗 Pd = (Vin - Vout) × Iout。示例：若 Vin = 12V，Vout = 9V，Iout = 150mA，则 Pd = 0.45W。SOT-89-3 为小型封装，热阻较大，长时间高功耗工作时需注意结温与环境散热，必要时采用降额、散热铜箔或更大封装替代。实际允许的功耗请以厂方热阻和温升曲线为准。
五、布局与外部元件建议
- 输入端建议并联 0.1µF~1µF 陶瓷去耦电容，靠近输入引脚布置以抑制高频干扰。
- 输出端建议使用 1µF~10µF 的低 ESR 电容（如陶瓷或钽电容）以保证环路稳定与瞬态响应。具体电容类型与容量应参考厂商数据手册的稳定性要求。
- 布局时保持输入、输出走线短且粗，地线回流通道清晰，以减小噪声和压降。
六、典型应用场景
适用于电池供电的便携设备、便携式测量仪器、低功耗传感节点、MCU 外设供电以及其他需 9V 稳压且要求超低静态电流的嵌入式系统。注意在高输入电压或大输出电流工况下的热设计。
七、选型与使用注意
- 输入电压须高于 Vout 加上在最大输出电流时的压差；由于压差随电流变化，150mA 工况下的最小 Vin 应参照数据手册。
- 封装与引脚定义（SOT-89-3）请以 HOLTEK 官方数据手册为最终依据，器件上电与保护特性（如过流、过温保护）亦以原厂资料为准。
总结：HT7590-3 提供了 9V 固定输出、超低静态电流与小型封装的结合，适合对待机功耗敏感且封装受限的中低功率应用。在实际设计中，请根据负载电流、输入电压和散热条件进行功耗与温升评估，并遵循厂商关于外部电容与 PCB 布局的建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
