Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HOLTEK HT16K33A-28SSOP HT16K33A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
15
specifications
Core information
- Product name
- HOLTEK(Holtek / Holtek) HT16K33A-28SSOP
- Type
- HOLTEK
- Minimum package
- 50 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HOLTEK(Holtek / Holtek)
- Electronic Component
- HT16K33A-28SSOP
- Electronic Component
- 1
- Package
- SSOP-28
- Electronic Component
- LCDDriver
- Electronic Component
- 0.468g
- Electronic Component
- 1
- Features
- Built-in Oscillator; Integrated Button
- Electronic Component
- BM0257709619
- Electronic Component
- Electronic Component
- Electronic Component
- 50
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HT16K33A-28SSOP 产品概述
一、产品简介
HT16K33A-28SSOP 是台湾 HOLTEK（合泰/盛群）推出的一款集成式 LED 驱动与按键扫描控制器。器件内置振荡器并集成按键功能，适合中小型点阵/段码显示与多键输入检测的应用场景。28 引脚 SSOP 封装便于 PCB 布局与工业化生产。
二、主要特性
- 内置振荡器，系统不再依赖外部时钟源，简化 BOM。
- 集成按键扫描，可处理多路按键矩阵，并支持中断输出，减轻主控循环轮询负担。
- 支持点阵与段码显示驱动，适用于多种 LED 显示组合（例如 8x16、16x8 等矩阵配置）。
- 采用串行两线接口（兼容 I2C），便于与 MCU 通信与地址配置，减少 IO 占用。
- 内部显示 RAM 与扫描驱动，支持亮度控制与动态刷新，由器件内部完成时序管理。
三、封装与引脚
- 封装形式：SSOP-28，适合表面贴装工艺，节省 PCB 面积。
- 常见引脚包括电源、GND、串行数据/时钟、按键中断输出以及多路 LED 驱动列/段控制端口。合理布线与去耦电容对稳定性有明显帮助。
四、典型应用场景
- 各类仪表面板、消费类产品的数码/点阵显示（例如小家电、控制面板）。
- 带有多按键输入的交互式界面（遥控器、控制器、用户操作面板等）。
- 需要节省 MCU IO 且要求显示与按键集中管理的嵌入式系统。
五、设计提示与注意事项
- 虽内置振荡器，但建议在电源线上加适当去耦电容以抑制干扰，提升显示稳定性。
- LED 阵列时应考虑限流和散热，按需配合外部限流电阻或选择合适的 LED 驱动配置以保证亮度与一致性。
- 按键扫描输出可配置中断，建议合理设计中断处理逻辑与去抖策略，兼顾响应性和误触抑制。
- 串行接口的地址与速率配置请参考芯片手册，多个器件并联时需保证地址唯一。
六、选型与资料获取
HT16K33A-28SSOP 适用于追求低 BOM、集成化驱动与按键功能的中小规模显示方案。欲获取详细电气参数、引脚定义、寄存器映射与参考电路，请参考 HOLTEK 官方数据手册。如需，我可以提供常用连接示意与 MCU 驱动思路。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
