Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HOLTEK BS83B04C
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
15
specifications
Core information
- Product name
- HOLTEK(Holtek / Holtek) BS83B04C
- Type
- HOLTEK
- Minimum package
- 100 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HOLTEK(Holtek / Holtek)
- Electronic Component
- BS83B04C
- Electronic Component
- 1
- Package
- SOP-8
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 0.19g
- Electronic Component
- 1
- Features
- (BOR / LVD / LVR / LVI); positions(POR); Gate positions; Built-in General Purpose;; positions
- Electronic Component
- BM0220281142
- Electronic Component
- Electronic Component
- Electronic Component
- 100
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：HOLTEK BS83B04C
一、基本信息
HOLTEK（台湾合泰/盛群）是一家专注于集成电路设计和开发的公司，产品涵盖了多种应用领域，如消费电子、通讯、工业控制等。其中，BS83B04C是一款高性能的8位微控制器（MCU），采用SOP-8封装，具有广泛的应用潜力。
二、技术特性
8位微控制器架构： BS83B04C采用8位微控制器架构，适合用于对计算能力要求不高、但对成本和功耗有严格要求的应用场景。
高效能的CPU： BS83B04C集成了一款高效能的8位中央处理器，能够实现快速的程序执行和响应，确保系统的实时性和流畅性。
丰富的I/O接口： 本款MCU具有多个可编程的I/O端口，用户可以根据具体需求灵活配置，方便与各种外部设备进行互联和数据交互。
内置存储器： BS83B04C提供适量的内置Flash和RAM存储，能够存储用户代码和程序运行所需的临时数据，满足小型应用的需求。
低功耗设计： 此微控制器特别针对电池供电及低功耗应用进行了优化，具有多种省电模式，可以显著延长电池使用寿命，适合便携式设备。
多种工作频率： 产品支持多种工作频率，使其能够在不同的应用场景中，灵活应对运行性能的要求。
三、应用场景
BS83B04C的设计使其适用于众多行业和应用，包括但不限于：
家用电器： 适用于洗衣机、微波炉等家电的控制系统，负责基础的逻辑控制和用户交互。
消费电子产品： 可以广泛应用于遥控器、电子玩具和其他低功耗消费电子设备。
智能家居： 在智能家居系统中，BS83B04C可作为传感器的数据处理单元，和无线模块结合，实现家庭自动化。
工业自动化： 适合监控和控制工业设备，提供实时数据处理，确保设备稳定运行。
电池供电的便携式设备： BS83B04C的低功耗特性使其非常适合电池供电的便携式设备，如健康监测仪器、手持式仪表等。
四、开发支持
HOLTEK为BS83B04C提供了全面的开发支持，包括：
开发工具： HOLTEK提供多种开发工具和参考设计，以帮助工程师快速上手，降低开发难度。
编程环境： 支持多种编程语言和环境，方便用户按需选择，确保软件开发的灵活性和效率。
技术支持： HOLTEK配备了专业的技术支持团队，随时为客户解答疑问，提供相关的技术指导和帮助。
五、总结
HOLTEK BS83B04C作为一款高效低功耗的8位微控制器，在众多应用领域中展现出强大的适应性和灵活性。凭借其丰富的I/O接口、内置存储器和多种工作模式，它是实现智能设备、消费电子和工业控制等多种应用的理想选择。加之HOLTEK提供的优质开发工具和技术支持，BS83B04C无疑为开发人员提供了一个强大的平台，助力实现创意和功能设想。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
