WMSIC Electronic Components

HOLTEK HT7K1201

ModelHT7K1201
PackageSOT-23-6
BrandHOLTEK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
HOLTEK(Holtek / Holtek) HT7K1201
Type
HOLTEK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HOLTEK(Holtek / Holtek)
Electronic Component
HT7K1201
Electronic Component
1
Package
SOT-23-6
Electronic Component
Brushed DC Motor Driver IC
Electronic Component
0.047g
Electronic Component
1
Integrated FET
Electronic Component
H
1
Features
Current Sampling /; Motor
Electronic Component
BM0000631802
Resistor
500mΩ
Current
1.3A
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HT7K1201 产品概述

一、产品简介

HT7K1201 是 HOLTEK(台湾合泰/盛群)推出的一款集成 FET 的单通道 H 桥驱动芯片,封装为 SOT-23-6,工作电压范围宽(1.8V–6V),适用于便携式与电池供电的小功率直流电机及惯性负载驱动。器件工作温度范围为 -40℃ 到 +85℃,静态电流仅 800μA,适合低功耗系统长时间待机使用;峰值电流能力可达 1.3A,用于短时冲击或突发负载。

二、主要性能参数

  • 工作温度:-40℃ ~ +85℃
  • 工作电压:1.8V ~ 6V,兼容 1.8V 低压 MCU 及常见 3.3V/5V 系统
  • 峰值电流:1.3A(短时脉冲)
  • 导通电阻(Rds(on)):约 500mΩ(单路)
  • 静态电流(Iq):800μA,低待机损耗
  • H 桥数量:1(单路双向驱动)
  • 集成 FET:是(简化外部功率器件设计)
  • 封装:SOT-23-6,适合空间受限应用

三、典型应用场景

  • 手机/可穿戴设备的振动马达驱动
  • 小型玩具电机、微型风扇、摄像头模组的对位/对焦驱动
  • 便携电器与 IoT 终端的小功率执行器
  • 需双向控制且受限于 PCB 空间的驱动场合

四、设计与使用要点

  • 热限与持续电流:峰值 1.3A 为短脉冲能力,持续电流受封装与 PCB 散热限制。建议按 P = I^2·Rds(on) 估算导通损耗,并结合 PCB 铜箔散热进行热预算;在 500mA~1A 区间需注意温升。
  • 电源布线:在电源引脚附近放置 1μF~10μF 低 ESR 去耦电容,靠近器件焊盘,以抑制瞬态电流和电压尖峰。
  • 感性负载保护:器件内部含体二极管,但对强感性或高能量反冲建议并联吸收网络(RC 抑制、TVS)以保护电源与器件。
  • PWM 驱动:支持 PWM 控制实现速度或力矩调节。常用 PWM 频率为几 kHz 到几十 kHz,频率选择需平衡开关损耗与噪声(高频会增加切换损耗)。
  • 接口兼容性:逻辑阈值随 Vcc 变化,适配 1.8V/3.3V/5V MCU 前需确认输入阈值和上/下拉要求。
  • 布局建议:SOT-23-6 封装散热依赖 PCB,增大铜箔面积和加多通孔可改善散热;把电源回路短化、将感性负载线远离敏感模拟线。

五、封装与选型建议

SOT-23-6 小外形适合空间受限设计,但散热能力有限。若设计中存在长时间高电流工况,建议选用更大封装或增加外部 MOSFET。HT7K1201 更适合短时冲击或中小电流的双向驱动场合,如振动马达、小型直流电机等。选型时请结合系统的连续电流需求、PWM 工作占空比与 PCB 散热能力进行验证测试。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.