WMSIC Electronic Components

HOLTEK HT16H25-100LQFP HT16H25

ModelHT16H25-100LQFP
PackageLQFP-100(14x14)
BrandHOLTEK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 73880

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
HOLTEK(Holtek / Holtek) HT16H25-100LQFP
Type
HOLTEK
Minimum package
90 托盘

Technical parameters

Electronic Component
1/5,1/4,1/3,1/2,1/1
Electronic Component
Electronic Component
Electronic Component
HOLTEK(Holtek / Holtek)
Electronic Component
HT16H25-100LQFP
Electronic Component
1
Package
LQFP-100(14x14)
Electronic Component
LCDDriver
Electronic Component
15g
Frequency
245.76kHz
Electronic Component
1
Features
Integrated; Built-in Oscillator
Electronic Component
BM0265002418
Operating Temperature
40℃~+85℃
Operating Voltage
2.4V~5.5V
Operating Current
5uA
Interface Type
I²C; 3 Interface

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HT16H25-100LQFP 产品概述

HT16H25-100LQFP 是台湾 HOLTEK(合泰/盛群)推出的一款高集成度 LED 显示驱动控制器,适用于大尺寸点阵或多段式 LED 面板。器件集成升压电路与振荡器,支持 I²C 与 3 线串行接口,工作电压范围宽(2.4V〜5.5V),在低功耗与高驱动能力之间取得良好平衡,适合便携与工业级显示应用。

一、主要规格亮点

  • 工作电压:2.4V〜5.5V
  • 接口类型:I²C;3 线串行接口
  • 静态/待机电流:约 5 μA
  • 显示配置:60 × 16 bit(可直接驱动大尺寸点阵)
  • 驱动时钟/频率:245.76 kHz
  • 偏压选择:1/5、1/4、1/3、1/2、1/1(多级亮度/线性化调整)
  • 工作温度:-40 ℃〜+85 ℃
  • 功能特性:内置升压电路、内置振荡器
  • 封装:LQFP-100(14 × 14 mm)

二、功能与优势

HT16H25 集成化程度高,内置升压电路可直接为 LED 提供足够驱动电压,降低外部升压元件数量;内置振荡器与 245.76 kHz 的驱动时钟支持稳定的多路扫描与 PWM 调光,偏压可选项有利于亮度与功耗的折中设计。此外器件待机电流低(约 5 μA),非常适合电池供电的便携终端。

三、接口与控制

器件同时支持标准 I²C 总线与三线串行控制,便于与 MCU/主控系统通信与集成。在 I²C 模式下可实现多芯片寻址与总线共享;三线模式在简单控制或对实时性要求较高的场景中可降低通信开销。使用时需在 I²C 总线上配置合适的上拉电阻,并根据时序手册设定通信速率与时序约束。

四、典型应用

  • 仪器仪表与工业控制面板的大尺寸点阵显示
  • 手持设备、智能家居、便携终端的图形/文字显示
  • 消费类电器与医疗设备的状态/信息显示
  • 需要低功耗与高可靠性的户外或车载显示(在合适的封装防护下)

五、设计注意事项

  1. 外围布局:尽量靠近 VDD/AGND 布局去耦电容,减小噪声对驱动稳定性的影响。
  2. 升压回路:若使用内部升压功能,注意外部电感、电容的选型与布局,遵循供应商应用指南以保证效率与电磁兼容。
  3. 散热与封装:LQFP-100 封装需关注焊盘与散热路径,长时间高亮工作时评估结温。
  4. 接口保护:对 I²C 总线与三线接口增加电气保护(TVS、限流等)以提高可靠性。
  5. 偏压与亮度:根据显示内容与功耗要求选择合适偏压比,并通过 PWM 或扫描频率进行亮度与闪烁优化。

HT16H25-100LQFP 以其高集成、低功耗与多样化接口,适合需要驱动大规模 LED 阵列且对空间与 BOM 成本敏感的设计。请结合 HOLTEK 官方数据手册进行详细电气参数、时序和典型电路的核对与验证。

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