WMSIC Electronic Components

HANRUN HY601742E

ModelHY601742E
PackageSMD
BrandHANRUN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HANRUN HY601742E
Type
HANRUN
Minimum package
41 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HANRUN
Electronic Component
HY601742E
Electronic Component
1
Package
SMD
Electronic Component
Transformer
Electronic Component
10/100 Base-T
Electronic Component
1.332g
Electronic Component
1:1
Inductor
350uH
Electronic Component
1
Electronic Component
BM0259565565
Operating Temperature
40℃~+85℃
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
41

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HY601742E 网口变压器 产品概述

一、产品概述

HY601742E 为 HANRUN(汉仁)出品的一款 SMD 封装以太网磁性元件,规格为 1:1 匝数比、适用于 10/100 Base-T 应用。器件外形为 SMD-16P,外形尺寸 12.7×7.1 mm,电感量 350 μH,隔离电压(Vrms)1.5 kV,工作温度范围 -40℃~+85℃。适用于在以太网 PHY 与 RJ45 插座之间提供信号耦合与共模干扰抑制,并满足基本的电气隔离要求。

二、主要技术参数

  • 匝数比:1:1
  • 速率:10/100 Base-T(支持 10/100 Mbps 以太网)
  • 电感值:350 μH(典型)
  • 隔离电压:1.5 kV(Vrms)
  • 工作温度:-40℃ 至 +85℃
  • 封装:SMD-16P,尺寸 12.7×7.1 mm
  • 品牌:HANRUN(汉仁)

三、产品特点

  • 针对 10/100Base-T 优化的传输特性与共模抑制能力;
  • 1:1 匝数比,保证信号幅度与相位匹配,便于直接与多款 PHY 连接;
  • 1.5 kV 隔离等级,提供基本的电气安全隔离与共模干扰阻断;
  • 紧凑 SMD 封装,便于自动化贴装与高密度 PCB 布局。

四、典型应用

  • 企业级与消费类路由器、交换机的端口磁性隔离;
  • 网关、工业以太网设备、PoE 非受电端配套磁芯(非承诺 PoE 功率特性,需按具体型号确认);
  • 任何需要 10/100 Mbps 以太网信号耦合与隔离的电路设计。

五、设计与使用建议

  • 在 PCB 布局中应将器件靠近 RJ45 插座或 PHY 芯片放置,以减少串扰与信号走线长度;
  • 保持主次侧走线对称,避免不必要的绕线和长走线引入阻抗失配;
  • 为达到隔离等级,保持主次侧之间符合规定的爬电与间隙距离,必要时参考公司及安全规范加大间距;
  • 焊接采用推荐回流曲线与焊料,避免过热导致磁芯或漆包线损伤;清洗时注意选择不会侵蚀磁性材料的溶剂;
  • 具体引脚定义、中心抽头与接线方式请参照原厂数据手册以确保正确接法与性能达标。

六、包装与可靠性

  • SMD 自动贴装包装,适合批量 SMT 生产线;
  • 适用工作温度范围宽,满足工业级温度要求;
  • 出货时建议向供应商索取最新的产品规格书与可靠性测试报告(如耐压测试、温循环、机械冲击/振动等),以便在关键项目中验证可靠性与一致性。

若需电气特性曲线、引脚图及 PCB 推荐封装,请提供联系方式或索取 HANRUN 官方数据手册(型号 HY601742E),以获取完整的参数与安装图纸。

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