WMSIC Electronic Components

HANRUN HR681616

ModelHR681616
PackageSMD
BrandHANRUN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HANRUN HR681616
Type
HANRUN
Minimum package
40 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HANRUN
Electronic Component
HR681616
Electronic Component
1
Package
SMD
Electronic Component
Transformer
Electronic Component
10/100 Base-T
Electronic Component
0.8g
Electronic Component
1CT:1CT
Inductor
120uH
Electronic Component
1
Electronic Component
BM0259565567
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
40
Voltage(Vrms)
1.5kV

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HR681616 产品概述

一、产品简介

HR681616 为 HANRUN(汉仁)出品的一款 SMD 封装网络磁性元件,适配 10/100 Base‑T 以太网接口。器件采用对称绕组设计(匝数比 1CT:1CT),在保持差模信号传输的同时提供必要的共模抑制与隔离保护。典型应用为 RJ45 插座与以太网收发器(PHY)之间的耦合与保护。

二、主要参数与特点

  • 匝数比:1CT:1CT(双对称绕组,带中点抽头),便于差分与共模处理。
  • 工作速率:支持 10/100 Base‑T,以太网物理层常见速率。
  • 电感值:120 μH(表征共模/磁通特性,对低频噪声抑制有效)。
  • 隔离电压:1.5 kV Vrms(绝缘与安全隔离用途)。
  • 封装:SMD,便于自动贴装与回流焊工艺。
    这些特性使 HR681616 在常规工业与商用以太网端口中具备良好的电磁兼容与安全隔离能力。

三、典型应用场景

  • 10/100 Base‑T 以太网端口磁耦合/共模抑制器件;
  • 嵌入式网络设备(路由器、交换机、网关)与模块接口;
  • 工业以太网前端接口,需一定隔离电压和抗干扰能力的场合;
  • 对体积、自动化贴装有要求的消费电子与通信设备。

四、封装与布局建议

  • SMD 形式便于靠近 RJ45 座或 PHY 布局,建议将器件放置在物理接口与 PHY 之间以缩短信号走线;
  • 中点抽头(CT)根据系统需要接入偏置(如连接到供电或接地)时,注意遵循 PHY / 系统设计说明;
  • PCB 布线注意差分对对称性、最小化回流回路面积,避免穿过敏感模拟电路区;
  • 回流焊温度曲线按厂家推荐,避免过高峰值温度对磁芯与绝缘材料造成损害。

五、可靠性与测试要点

在设计验证中建议关注以下测试项目:耐压(Hi‑Pot)、绝缘电阻、直流电阻(DCR)、磁化电流、插入损耗与回波损耗(S 参数)、共模抑制比(CMRR)以及在温度循环与潮湿条件下的长期稳定性测试。隔离等级 1.5 kV Vrms 在某些更严格的工业/安规场合可能需额外评估。

六、选型与替代注意事项

选型时除上述标称参数外,还应确认:最大工作电流、在目标频段的频率响应、插入损耗与回波损耗指标、以及是否满足系统所需的安规标准(如 IEC/EN 要求)。如需更高隔离或更高频段性能,可选用同类厂商更高规格或其他型号替代。若需进一步匹配 PoE 应用,应核实电流承载能力与温升特性。

如需更详细的电气特性曲线、封装图与推荐焊盘,请提供是否需要查询官方 Datasheet 或样片评估,我可继续协助。

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