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HANRUN HR600956E
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HANRUN HR600956E
- Type
- HANRUN
- Minimum package
- 50 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HANRUN
- Electronic Component
- HR600956E
- Electronic Component
- 1
- Package
- SMD-8P,7.1x5.5mm
- Electronic Component
- 1uH
- Inductor
- 63uH
- Electronic Component
- Power Supply Transformer
- Electronic Component
- 0.3g
- Electronic Component
- 1:1
- Electronic Component
- 1
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- BM0259565557
- Electronic Component
- Electronic Component
- Electronic Component
- 50
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HR600956E 产品概述
一、产品简介
HR600956E 为 HANRUN（汉仁）出品的一款高可靠性线圈类器件，封装为 SMD-8P（外形尺寸 7.1 × 5.5 mm）。器件为单路一次、单路二次的等匝比结构（匝数比 1:1），适用于需要电气隔离与信号/能量耦合的小型化应用场景。器件在尺寸与电气特性之间进行了平衡，适合表面贴装自动化生产。
二、关键参数
- 匝数比：1:1
- 一次绕组：单路
- 二次绕组：单路
- 额定隔离电压：1.5 kVrms
- 标称电感：63 μH
- 漏感（漏电感）：1 μH
- 封装：SMD-8P，7.1 × 5.5 mm
- 品牌：HANRUN（汉仁）
- 描述：未分类（用户选型时请以厂家资料为准）
三、主要特性
- 等匝比结构，适合保持信号幅度或电压比的场合；对称绕组利于互感稳定性。
- 1.5 kVrms 的隔离能力，能够为低至中等电压等级的电气隔离提供保护。
- 63 μH 的电感量适合中低频耦合或滤波用途；1 μH 的漏感控制较好，可减小寄生影响。
- 小型 SMD 封装适配现代高密度 PCB 布局与贴片生产工艺。
四、典型应用
- 隔离信号耦合与脉冲变换电路（如小功率隔离驱动器）。
- EMI/滤波网络中的共模/差模耦合元件（视具体电路需求）。
- 小型 DC-DC 隔离模块的磁性元件参考（需结合电流能力与频率特性评估）。
- 工业与通信设备中对电气隔离有中等要求的场合。
五、封装与机械信息
- 封装类型：SMD-8P 贴片式，外形 7.1 × 5.5 mm，适合回流焊工艺。
- 推荐在 PCB 设计时为绕组端子留出充足焊盘面积，并考虑过孔/地平面以改善热管理与绝缘距离。
六、设计与使用建议
- 在高频或快速边沿应用中，需注意漏感对性能的影响，应在仿真或样机测量中验证。
- 对于需承受高绝缘等级的应用，应进行耐压与爬电距离验证，必要时采用更高绝缘等级器件或加强 PCB 绝缘处理。
- 建议参考 HANRUN 官方数据手册获取详尽的频率响应、额定电流、直流电阻（DCR）及焊接温度规范，按厂家建议的回流焊曲线进行焊接。
- 设计时考虑器件的热阻与周边散热条件，必要时在 PCB 上留出热沉或加大铜面积。
七、采购与质量
- 型号：HR600956E，品牌 HANRUN（汉仁）。
- 由于产品描述为“未分类”，建议向供应商索取最新数据手册与检验报告，确认环境可靠性、认证（如需要）及批次一致性，以保证设计与生产稳定性。
如需更详细的电气频率响应曲线、额定电流及温升数据，可提供邮件或型号需求，我可协助查找或整理厂方资料与实际测试建议。
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