WMSIC Electronic Components

HRS FH34SRJ-30S-0.5SH(50) FH34SRJ

ModelFH34SRJ-30S-0.5SH(50)
PackageSMD, P=0.5mm
BrandHRS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HRS FH34SRJ-30S-0.5SH(50)
Type
HRS
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRS
Electronic Component
FH34SRJ-30S-0.5SH(50)
Electronic Component
1
Package
SMD, P=0.5mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.255g
Electronic Component
0.5mm
Electronic Component
1
Electronic Component
BM69420216
Electronic Component
Electronic Component
Operating Temperature
55℃~+105℃
Electronic Component
1mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
30P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:FH34SRJ-30S-0.5SH(50) 连接器

一、产品基本信息

FH34SRJ-30S-0.5SH(50) 是由日本广濑(Hirose)生产的一款FFC/FPC(柔性扁平电缆/柔性印刷电路)连接器。该连接器具有30个触点,间距为0.5毫米,采用双侧触点设计,适合上下接触方式。它的封装方式为表面贴装(SMD),主要用于各种现代电子设备中的信号传输。

二、产品特点

  1. 高密度设计:FH34SRJ-30S-0.5SH(50) 的30针配置与0.5mm的接触间距,使其拥有更高的连接密度,非常适合空间有限的电子设备中使用。

  2. 双侧触点设计:这种设计增强了连接的可靠性,能够适应更多样化的电缆排列方式,有效地减小了组件的整体高度。

  3. 便于自动化贴装:作为SMD类型,FH34SRJ-30S-0.5SH(50) 适合于自动化生产线,通过波峰焊或回流焊进行安装,提高了生产效率。

  4. 稳固的锁定机制:该连接器设计有安全的锁定机制,在连接时能够提供稳定且可靠的接触,避免因振动或移动而导致的接触不良。

  5. 优质材料:广濑针对该连接器所采用的材料经过严格筛选,具有良好的耐热性、耐腐蚀性,以及优良的电气性能和机械性能。

三、应用场景

FH34SRJ-30S-0.5SH(50) 连接器广泛应用于各种电子产品中,主要包括但不限于如下领域:

  1. 消费电子:如智能手机、平板电脑、笔记本电脑等移动设备中,FFC/FPC 连接器在内部组件之间提供稳定的可靠连接。

  2. 工业设备:在工业自动化系统中,FFC/FPC 连接器可以用于传感器、执行器等设备之间的信号传输,确保控制系统的可靠运行。

  3. 医疗设备:在医疗器械中,例如便携式超声仪器、监控设备等,使用高密度的连接器可以实现紧凑的设计和高效的信号传输。

  4. 汽车电子:随着汽车电子化程度的提高,该连接器也被应用于车载电子系统,如信息娱乐系统、导航系统及安全控制系统等。

四、技术规格

  • 型号:FH34SRJ-30S-0.5SH(50)
  • 触点数:30P
  • 触点间距:0.5mm
  • 连接器类型:FFC/FPC连接器
  • 封装类型:SMD, 卧贴设计
  • 工作温度范围:通常为-40°C至+85°C
  • 电流额定值:每个触点的额定电流通常为500mA,具体应根据实际应用情况和使用条件确定。

五、总结

FH34SRJ-30S-0.5SH(50) 连接器凭借其小巧、高密度的特性和可靠的接触设计,成为现代电子产品中不可或缺的组成部分。无论是在消费电子、工业设备,还是在医疗和汽车电子领域,其优良的性能和广泛的适用性使其成为设计工程师的理想选择。凭借广濑在连接器行业的领导地位与品质保证,FH34SRJ-30S-0.5SH(50)为各种应用提供了有效的解决方案,助力电子产品实现更高的性能与稳定性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.