Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HRS DF11-8DS-2C DF11
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HRS DF11-8DS-2C
- Type
- HRS
- Minimum package
- 100
Technical parameters
- Electronic Component
- HRS
- Electronic Component
- DF11-8DS-2C
- Electronic Component
- 1
- Package
- P=2mm
- Electronic Component
- 2
- Electronic Component
- (Wire-to-Board / Wire-to-Wire)
- Electronic Component
- 2mm
- Electronic Component
- 0.18g
- Electronic Component
- 2mm
- Electronic Component
- Electronic Component
- Electronic Component
- 1
- Electronic Component
- BM0230812380
- Socket
- 2x4P
- Electronic Component
- Electronic Component
- PIN
- 4
- Electronic Component
- UL94V-0
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DF11-8DS-2C 产品概述
产品简介
DF11-8DS-2C是一款由日本广濑（HRS）公司推出的高品质电子连接器，专门用于信号和电源的线对板或线对线连接。作为一款2x4P配置的连接器，DF11-8DS-2C具有卓越的连接性能和可靠性，适合广泛的电子设备应用，如工业自动化、通信设备和消费电子等领域。
基本参数描述
DF11-8DS-2C的基本参数包括一个胶壳结构，具体为2行4针（2x4P），每排的针位数为4，针脚间距（P）为2mm。这种设计使得连接器在结构上紧凑，非常适合空间有限的应用环境。同时，DF11-8DS-2C不带锁扣的特性简化了连接过程，使得插拔更加方便，适应快速装配的需求。
封装与实用性
该连接器的封装采用了2mm行距设计，相较于其他更大间距的连接器，DF11-8DS-2C较小的间距允许在复合功能或密度更高的电路板上进行更有效的空间管理，从而减少了电路板整体尺寸。此外，其胶壳结构提供了良好的物理保护，能够有效抵御外部环境对连接器及内部电路造成的潜在损坏。
电气性能
DF11-8DS-2C支持较高的电流承载能力，适合多种电压和电流传输的需求。同时，它所用的材料和电镀工艺确保了连接器在长时间使用下的良好导电性，减少了接触电阻，确保信号传输的稳定性和可靠性。此外，该产品在耐湿性、耐温性等方面也表现优异，能够适应苛刻的工作环境。
应用场景
DF11-8DS-2C广泛应用于多种领域，包括但不限于：
工业自动化：在自动化设备及控制系统中，DF11-8DS-2C可用于连接传感器、执行器和控制器，实现高效的数据和电源传输。
通信设备：在网络和通信线路中，DF11-8DS-2C可用于各种信号传输，保证数据准确无误地传递。
消费电子：在各种电子产品中，如电视、音响和家用电器，DF11-8DS-2C可以作为内部连接器，实现不同模块之间的联接。
汽车电子：在现代汽车中，DF11-8DS-2C可用于连接传感器、控制模块及显示器等元件，提升汽车电子系统的可靠性和稳定性。
总结
DF11-8DS-2C由HRS（广濑）推出，作为一款2x4P的高性能连接器，凭借其优良的设计和电气性能，适用于多种工业和消费领域。小巧的2mm间距设计不仅节省了宝贵的电路板空间，同时保证了连接的安全性和可靠性。无论是对高要求的工业应用还是日常消费电子产品，DF11-8DS-2C都能够提供可靠的解决方案，是连接器市场中一款不可或缺的优秀产品。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
