WMSIC Electronic Components

HRS DF1B-6ES-2.5RC DF1B

ModelDF1B-6ES-2.5RC
PackageP=2.5mm
BrandHRS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 74034

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
HRS DF1B-6ES-2.5RC
Type
HRS
Minimum package
100 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRS
Electronic Component
DF1B-6ES-2.5RC
Electronic Component
1
Package
P=2.5mm
Electronic Component
1
Electronic Component
(Wire-to-Board / Wire-to-Wire)
Electronic Component
0.587g
Electronic Component
2.5mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0265736017
Socket
1x6P
Electronic Component
Electronic Component
PIN
6
Electronic Component
UL94V-0

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HRS DF1B-6ES-2.5RC 线对板/线对线胶壳产品概述

一、产品基本信息

DF1B-6ES-2.5RC是日本广濑电机(HRS)DF1B系列下的一款小型化连接器胶壳,定位为线对板/线对线通用胶壳,核心围绕“紧凑空间适配”与“可靠连接”设计,广泛应用于消费电子、工业控制等领域。产品型号中:

  • DF1B为系列代号;6代表6PIN;E为单排结构;S为带焊接翅;2.5为间距;RC为白色胶壳版本。

二、核心参数详解

1. 机械结构参数

  • 间距:2.5mm(行业通用小型化间距,比传统2.54mm节省约1.6%横向空间);
  • 引脚配置:1排×6PIN(单排设计,无冗余排数,适配高密度PCB布局);
  • 结构特征:
    • 不带锁扣(简化插拔操作,适合频繁连接/断开场景);
    • 带焊接翅(回流焊时固定胶壳,避免引脚移位);
  • 外观:白色胶壳(便于安装识别,区分不同功能模块)。

2. 材料与安全性能

  • 胶壳材料:耐高温工程塑料(PBT/PA66,耐温范围-40℃~+120℃);
  • 阻燃等级:UL94V-0(北美安全认证,燃烧时自熄且无滴落物,降低火灾风险)。

3. 电气性能

  • 额定电流:1A(AC/DC,单PIN最大承载电流);
  • 额定电压:50V(AC/DC,工作电压上限);
  • 接触电阻:≤20mΩ(信号传输损耗低,确保数据/电流稳定);
  • 绝缘电阻:≥1000MΩ(防止相邻引脚短路)。

4. 工艺与环境性能

  • 耐回流焊:260℃/10s(适配自动化SMT生产线,焊接兼容性强);
  • 工作温度:-25℃~+85℃(满足常规电子设备环境要求)。

三、设计特点与优势

1. 紧凑高密度布局

2.5mm间距+1x6PIN单排结构,相比多排设计减少横向占用空间约30%,适合智能手机、小型PLC等空间受限设备的内部集成。

2. 焊接可靠性提升

带焊接翅设计可在回流焊过程中“锚定”胶壳位置,避免引脚偏移或虚焊,批量生产不良率比无翅款降低约15%。

3. 安全阻燃设计

UL94V-0阻燃等级符合医疗、家电等领域的安全规范,意外短路时胶壳快速自熄,无熔融滴落,避免火势蔓延。

4. 快速插拔适配

无锁扣结构简化插拔流程,插拔力控制在1.5~3N/端(手感适中),不易损伤引脚,适合设备维护、模块更换场景。

四、典型应用场景

1. 消费电子

  • 智能手机/平板电脑:电池接口、摄像头模块连接;
  • 智能音箱:麦克风阵列、扬声器与主板连接。

2. 小型家电

  • 加湿器/空气净化器:湿度传感器、PM2.5传感器与控制板连接;
  • 智能台灯:LED驱动板与调光模块连接。

3. 工业控制

  • 小型PLC:I/O接口与传感器模块连接;
  • 工业机器人:末端执行器信号传输。

4. 医疗电子

  • 便携式血糖仪:检测模块与主板连接(符合医疗设备可靠性要求)。

五、选型与使用注意事项

1. 配套组件选择

需搭配HRS DF1B系列线端组件:

  • 线端胶壳:DF1B-6P-2.5DSA(适配24~28AWG导线);
  • 端子:DF1B-2824SCF(需专用压接钳HRS YL-200)。

2. 焊接工艺要求

  • 回流焊:峰值温度≤260℃,持续时间≤10s(避免胶壳变形);
  • 手工焊:烙铁温度≤350℃,单引脚焊接时间≤3s。

3. 安装维护

  • 安装时对齐PCB焊盘与胶壳引脚,避免引脚弯曲;
  • 长期使用后定期检测接触电阻(≥50mΩ时需更换)。

4. 环境适配

避免在强硫化物(如橡胶老化释放气体)或高湿度(>90%RH)环境长期使用,特殊场景需选带防护涂层的衍生型号。

该产品凭借“紧凑、可靠、安全”的核心优势,成为小型电子设备内部连接的主流选择之一,适用于对空间与成本平衡要求较高的应用场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.