WMSIC Electronic Components

HI-LINK(海凌科) B0505S-1WR3

ModelB0505S-1WR3
PackageSIP-4
BrandHI-LINK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HI-LINK B0505S-1WR3
Type
HI-LINK
Minimum package
43 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HI-LINK
Electronic Component
B0505S-1WR3
Electronic Component
1
Electronic Component
6mm
Package
SIP-4
Type
Electronic Component
Electronic Component
Isolated Power Supply Module
Electronic Component
1.39g
Electronic Component
11.6mm
Electronic Component
10.2mm
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0225276543
Operating Temperature
40℃~+105℃
Switching Frequency
100kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B0505S-1WR3 产品概述

一、产品简介

B0505S-1WR3 是海凌科(HI-LINK)推出的一款小功率隔离型DC-DC电源模块,输入5V直流电源,输出5V直流电源,最大输出电流200mA,输出功率1W。模块采用SIP-4直插封装,体积小、安装方便,适合在空间受限的PCB上实现电气隔离与电源变换。该产品具有额定隔离电压1.5kVrms 和输出短路保护等实用特性,转换效率高达约88%,在多数低功耗应用中表现优异。

二、主要电气参数

  • 输入电压范围:4.5V ~ 5.5V DC(典型应用以5V供电为主)
  • 输出电压:5V DC(稳压输出)
  • 最大输出电流:200mA
  • 最大输出功率:1W
  • 隔离电压:1.5kVrms(确保输入与输出之间的安全电气隔离)
  • 转换效率:典型值约88%(具体效率随输入/输出工况略有变化)
  • 保护特性:具备输出短路保护,提升系统可靠性

在满载(1W)和88%效率情况下,输入端功耗约为1.136W,模块自身损耗约0.136W,热量有限但仍需注意散热与布局。

三、封装与机械特性

模块采用SIP-4(4引脚直插)封装,便于通过孔插装和波峰焊接工艺生产。小型化外形使其适合嵌入式设备、电路板边缘或模块化设计中。安装时应留意输入和输出的隔离间距与爬电距离,满足安全设计要求。

四、应用场景

B0505S-1WR3 适用于需要隔离、低功率电源的场合,例如:

  • 工业控制与测量仪器中的信号隔离供电
  • 通信设备、接口电路的地线隔离
  • 数据采集模块、传感器前端的隔离电源
  • 消费类与便携设备中需要防止地环路干扰的子系统

其高隔离能力和短路保护使得在存在共模干扰或可能发生外部短路的环境中更为可靠。

五、使用建议与注意事项

  • 输入范围应严格控制在4.5V~5.5V,避免过压或欠压影响性能。
  • 为保证稳定性,建议在输入端并联适当的旁路电容(例如陶瓷0.1µF与电解/固态电容组合),输出端加低ESR滤波电容以抑制纹波与瞬态响应。
  • 虽然模块具有短路保护,但长期短路会影响使用寿命,设计中应考虑合理的保护与故障检测措施。
  • 布局时将输入与输出接地分开处理,保持隔离区的爬电距离与绝缘要求,避免不必要的电气耦合。
  • 满载工作时模块会产生一定热量,若在高环境温度或密闭空间使用,需采取散热或降额设计。

六、优势总结

B0505S-1WR3 以其稳定的5V输入/输出、1.5kVrms隔离、SIP-4小型封装以及近90%的转换效率,成为实现电气隔离与低功耗电源设计的理想选择。适用于需要可靠隔离和简便安装的工业与消费电子系统,能有效抑制地环路噪声并提升系统抗扰度。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.