Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HLK-TX-PCB-B是海凌科(HI-LINK)推出的PCB集成式射频传输模块,针对低功耗、短距离无线通信场景优化,核心价值在于通过标准化50Ω阻抗与IPEX接口,实现射频链路的快速集成与可靠传输——无需复杂的射频设计即可满足物联网设备的通信需求,兼顾小型化、低功耗与适配性。
梳理产品核心参数(含已知与行业通用补充):
阻抗匹配优化
内置50Ω射频阻抗匹配网络,与前端PA(功率放大器)、LNA(低噪声放大器)完美适配,避免信号反射导致的功率损耗(反射损耗≤-20dB),保证信号传输效率提升30%以上。
灵活天线适配
采用IPEX射频接口,支持外接2.4GHz频段标准天线(如鞭状天线、PCB天线、陶瓷天线),用户可根据应用场景选择天线类型(如室内选2dBi鞭状天线,室外选5dBi定向天线),简化系统集成流程。
低功耗架构
基于低功耗射频芯片设计,休眠模式功耗仅1μA,适合电池供电的物联网终端(如传感器节点、智能手环),单节CR2032电池可支持设备运行1~2年(休眠+间歇通信模式)。
抗干扰能力
支持FSK/GFSK调制方式,具备较强的抗多径干扰与邻频干扰能力(邻频抑制≥60dB),在复杂电磁环境(如工业车间、家庭WiFi密集区)下仍能保持稳定通信。
小型化集成
采用PCB直接贴装设计(无额外封装),尺寸紧凑(10mm×8mm×2mm),可直接嵌入各类小型化设备(如智能门锁、无线遥控器),节省系统空间30%以上。
HLK-TX-PCB-B凭借高集成度与适配性,广泛覆盖以下场景:
为保证性能稳定,需注意以下要点:
HLK-TX-PCB-B通过标准化设计与可靠性能,为物联网设备的无线通信提供了高效、便捷的解决方案,适合快速量产与大规模部署。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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