WMSIC Electronic Components

Infineon ESD101B102ELE6327XTMA1

ModelESD101B102ELE6327XTMA1
PackageSOD-882
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon ESD101B102ELE6327XTMA1
Type
SOD-882
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
ESD101B102ELE6327XTMA1
Electronic Component
1
Package
SOD-882
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.008g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.1pF
Electronic Component
BM0058428804
Operating Temperature
55℃~+125℃
Voltage
13V
Electronic Component
IEC 61000-4-5;IEC 61000-4-4;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD101B102ELE6327XTMA1 概述

ESD101B102ELE6327XTMA1 是英飞凌(Infineon)推出的一款双向(Bi-directional)超低电容瞬态抑制二极管(TVS),采用小型 SOD-882 封装,专为射频天线与超高速数据接口的静电放电(ESD)和浪涌保护而设计。器件在保持极低电容的同时提供可靠的浪涌吸收能力,适用于对信号完整性要求高的 USB 3.0、HDMI 1.4a 等高速差分链路以及天线接口保护。

一、主要技术参数

  • 类型:双向 TVS(Bi-directional)
  • 钳位电压(Vc):30 V
  • 击穿电压(Vbr):7.3 V
  • 反向截止电压(Vrwm):5.5 V(适配 5 V 系统)
  • 峰值脉冲电流(Ipp):2 A @ 8/20 μs
  • 封装:SOD-882
  • 典型应用:RF 天线、超高速接口(USB 3.0、HDMI 1.4a 等)

二、关键特性与优势

  • 超低电容:对高速差分信号的寄生影响最小,保证信号完整性与带宽,减少反射和串扰。
  • 双向保护:可在正负向瞬态事件下工作,适合无直流偏置或交流耦合的高速信号线及天线接口。
  • 与 5 V 系统兼容:Vrwm = 5.5 V,正常工作下不会影响 5 V 供电线路或接口。
  • 可靠的脉冲吸收能力:在标准 8/20 μs 浪涌下可提供 2 A 峰值脉冲电流,有效钳制高能瞬态。
  • 小型封装(SOD-882):便于高密度布局,适合移动设备、机顶盒及消费类电子产品的空间受限场合。

三、典型应用场景

  • 移动设备与 WLAN/蓝牙天线接口的 ESD 保护。
  • USB 3.0 SuperSpeed 差分对端口保护,兼顾高速信号的完整性。
  • HDMI 1.4a 接口的端口浪涌与静电防护。
  • 摄像头、RF 前端以及其他对寄生电容敏感的高速接口。

四、封装与布局建议

  • 靠近受保护的连接器或天线接口放置 TVS,尽量缩短线路长度以降低寄生电感。
  • 对地走短、粗的回流路径,必要时在 TVS 与地之间使用多个过孔以降低热阻和电感。
  • 在差分线对中,若为双向保护,将器件并联在差分对两端或共模路径,保证对称布局以减少模式转换。
  • 注意焊盘与热焊接工艺,SOD-882 支持常规回流焊流程,避免过热导致封装应力。

五、选型与使用注意事项

  • 若保护对象为有直流偏置的电源或单极性信号,请选择单向 TVS;本器件适合无偏或双极性场合。
  • 钳位电压较高(30 V),对极高能量冲击场合或需要更低夹断电压的应用,应评估能否满足系统保护要求。
  • 在需要更高脉冲能量吸收能力时,可并联多个器件或选用更大 Ipp 规格的 TVS,但需注意并联时的不均流问题与封装散热。
  • 推荐在系统级做 ESD 测试(人体模型、机器模型)与信号完整性验证,确保保护器件与系统兼容。

六、结论

ESD101B102ELE6327XTMA1 以其双向保护、超低电容与小型 SOD-882 封装,为对信号完整性敏感的射频天线和高速接口提供了平衡的保护方案。凭借 Vrwm = 5.5 V 的设计,它非常适合 5 V 系统中的 USB 3.0、HDMI 等高速链路,以及对电容要求严格的 RF 前端。实际应用中应结合 PCB 布局、接地与系统能量评估,确保最佳的保护效果与长期可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.