WMSIC Electronic Components

Infineon TLE42744DV50

ModelTLE42744DV50
PackageTO-252-2(DPAK)
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon TLE42744DV50
Type
TO-252-2(DPAK)
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
500mV@(250mA)
Electronic Component
INFINEON
Electronic Component
TLE42744DV50
Electronic Component
1
Package
TO-252-2(DPAK)
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.481g
Electronic Component
1
Features
Voltage
Electronic Component
BM0096067900
Operating Temperature
40℃~+150℃@(Tj)
Operating Voltage
40V
Output
Electronic Component
Output Voltage
5V
Output Current
400mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLE42744DV50 产品概述

一、产品简介

TLE42744DV50 是英飞凌(Infineon)面向高电压输入场景推出的一款固定输出线性稳压器(LDO),提供稳定的 5.0V 正向输出,最大输出电流可达 400mA。器件集成多重保护功能(过压、过流、短路与过热保护),适合需要高可靠性与低噪声电源的工业与汽车类应用。

二、主要参数(摘要)

  • 输出类型:固定(5.0V)
  • 工作电压:最高 40V 输入
  • 输出电流:最高 400mA
  • 静态电流(Iq):约 100μA
  • 压差(Dropout):500mV @ 250mA(在更大负载下压差会增加)
  • PSRR:60dB @ 100Hz
  • 保护功能:过压、过流、短路、过热保护
  • 工作结温:-40℃ ~ +150℃ (Tj)
  • 封装:TO-252-2 (DPAK),单通道,正输出

三、关键特性与优势

  • 宽输入电压能力(最高 40V)适应高瞬态或高压总线环境,如汽车负载坠落(load-dump)或工业电源。
  • 低静态电流(100μA)在待机或轻载时降低系统静功耗。
  • 优良的纹波抑制(PSRR 60dB @100Hz)适合敏感模拟前端和噪声敏感型数字电路。
  • 多重保护机制提高系统可靠性,防止短路、过流和过热导致的损坏。
  • DPAK 表面贴装封装利于散热管理并可直接焊接于具有良好铜面积的 PCB 上做热沉。

四、典型应用

  • 汽车与车辆电子(仪表、传感器供电、通信接口)
  • 工业控制与测量设备(传感器供电、数据采集前端)
  • 通信终端与嵌入式系统(微控制器、外围接口稳压)
  • 开关电源后端的低噪声本地线性稳压

五、设计与布局建议

  • 输入侧应使用低等效串联电阻(ESR)电容以抑制瞬态与高频噪声;输出侧通常建议并联陶瓷与钽电容组合以保证稳定性与良好瞬态响应。遵守厂商对输出电容最小容量与 ESR 范围的要求(若无数据,建议至少 10μF 陶瓷并配合 1–10μF 的有机电容)。
  • 注意压差:规格中 500mV 为 250mA 的参考值,驱动 400mA 时需要更大的输入余量(Vin ≥ Vout + 实际压差),以避免输出跌落。
  • 布局上把输入电容靠近器件 VIN 引脚放置,输出电容靠近 VOUT,引脚到地的回流路径应尽量短且铜箔面积充足。
  • 散热:DPAK 的散热依赖于 PCB 铜面积与过孔,重负载或高环境温度下需扩展散热铜箔并进行热仿真或测量,必要时外加散热器或增加 PCB 散热层。

六、热保护与可靠性

器件内置热关断,能在过热时保护器件与系统。实际使用时需对结温进行评估并在高温环境下做额定电流降额设计,确保长期可靠性。工作结温上限为 150℃,系统应保证在此范围内运行并留有安全裕度。

七、总结

TLE42744DV50 将高输入耐受性、低静态电流与良好纹波抑制结合在小型 DPAK 封装中,适合对可靠性和噪声有较高要求的工业与车载电源应用。设计时重点关注输入裕量与散热管理,并按厂商建议选择合适的输出电容与 PCB 布局,可获得稳定、低噪的 5V 电源输出。若需详细电气特性曲线及典型应用电路,建议参考英飞凌器件数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.