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IHHEC C1210X224K451T
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- IHHEC C1210X224K451T
- Type
- 1210
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- IHHEC
- Electronic Component
- C1210X224K451T
- Electronic Component
- 1
- Electronic Component
- 220nF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0227760325
- Electronic Component
- X7R
- Voltage
- 450V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1210X224K451T 产品概述
一、产品简介
C1210X224K451T 是 IHHEC（禾伸堂）系列高压多层陶瓷贴片电容器（MLCC），标称容量 220nF（224）、容差 ±10%（K）、额定直流电压 450V（451），介质类型为 X7R，封装为 1210（约 3.2 × 2.5 mm）。该器件结合了较高电压耐受能力与较大容值密度，适合电源前端与高压直流回路的去耦、滤波与缓冲应用。
二、主要性能特点
- 高电压等级：额定 450V DC，适配 400V 直流母线及高压电子电路的设计裕度。
- 稳定温度特性：X7R 介质在 -55°C 至 +125°C 范围内容值变化典型控制在 ±15% 左右，适用于宽温区工作环境。
- 容值与精度：220nF ±10%，在空间受限的板级设计中提供良好容量。
- 小封装大容量：1210 封装兼顾体积与可靠性，适用于自动贴装生产线。
- 良好焊接性与可靠性：多层陶瓷结构，适合回流焊工艺，耐振动和热循环性能优良。
三、典型应用场景
- 开关电源（SMPS）输入滤波与去耦，抑制高频纹波与电磁干扰（EMI）。
- 400V 级直流母线旁路与能量缓冲，用于变频器、逆变器与LED驱动电源。
- 高压耦合/旁路、Snubber 电路以及高压模拟前端滤波。
- 工业电源、商用家电与测试设备中对体积与电压双重要求的场合。
四、设计与使用注意事项
- 电压偏置效应：X7R 为高介电常数材料，随施加直流偏压容值会明显下降。设计时应做 DC-bias 测试并预留裕量，必要时选用更大标称值或并联电容。
- 温度与频率响应：X7R 在低温或高频条件下容值与损耗会有变化，关键电路建议进行实际环境验证。
- 焊接工艺：建议按供应商推荐的回流焊曲线进行温度控制，避免超温或过快降温导致的裂纹。贴装板时避免强烈弯曲或过度应力集中。
- 老化与可靠性：陶瓷电容可能存在随时间轻微容值漂移，长期可靠性与电压、温度、机械应力相关，量产前建议进行加速老化与可靠性评估。
五、包装与订购信息
常见供货形式为卷带（Tape & Reel），适配自动贴片机。订购时请提供完整料号（C1210X224K451T）、批量与必要的质量认证要求，以便确认包装和交付细节。
如需更详细的电气表征曲线（DC-bias、温度特性、等效串联电阻 ESR/ESL 等）、样片或可靠性测试报告，请联系我们或向禾伸堂技术支持索取相应数据手册。
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