WMSIC Electronic Components

ISOCOM SFH615A-4XSMT&R SFH615A

ModelSFH615A-4XSMT&R
PackageSMD-4
BrandISOCOM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ISOCOM SFH615A-4XSMT&R
Type
ISOCOM
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ISOCOM
Electronic Component
SFH615A-4XSMT&R
Electronic Component
1
Package
SMD-4
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.335g
Electronic Component
1
Electronic Component
BM0225176837
Operating Temperature
55℃~+110℃
Load Voltage
70V
Output Current
50mA
Output Type
Photoelectric Transistor
Output Channel Count
1
(Vf)
1.2V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SFH615A-4XSMT&R 产品概述

SFH615A-4XSMT&R 是一款单通道光电三极管光耦合器,采用 SMD-4 表面贴装封装,由 ISOCOM(英国安数光)出品。该器件以高隔离电压、宽工作温度范围和较大的输出电流能力为特点,适用于需要电气隔离且对响应速度及低饱和电压有要求的场合。

一、产品简介

SFH615A-4XSMT&R 内部由红外发光二极管(LED)和光电三极管组成,输入端为光发射二极管,输出端为光电三极管(开集电极型)。当输入 LED 导通时,光子激发输出晶体管导通,从而在隔离的输入与输出之间实现信号传递。该器件支持高达 5.3 kVrms 的隔离电压,并能在 -55 ℃ 到 +110 ℃ 的温度范围内可靠工作,适合工业环境与高可靠性电源系统中的隔离应用。

二、主要特性

  • 输出类型:光电三极管(开集电极输出)
  • 隔离电压(Vrms):5.3 kV
  • 工作温度范围:-55 ℃ ~ +110 ℃
  • 电流传输比(CTR):最小 13%,最大/饱和值可达 320%(视测试条件与工作点而定)
  • 输入 LED 正向压降(Vf):1.2 V(典型)
  • 输出电流:最高 50 mA
  • 直流反向耐压(Vr):4 V
  • 负载电压(最大集电极电压):70 V
  • 集射极饱和电压 VCE(sat):约 100 mV(标注条件下,如 20 mA / 1 mA)
  • 输出通道数:1(单通道)
  • 封装:SMD-4(表面贴装)

三、电气性能要点与设计考虑

  • CTR(电流传输比)在 13% 至 320% 的范围内变化,说明在不同输入电流、波长及温度条件下,输出电流相对于输入电流的放大比差异较大。电路设计时建议以最小 CTR 值作为保守设计基础,必要时通过实验校准。
  • 输出负载电压最高可达 70 V,适合较宽电压范围的上拉电路;但应注意器件功耗与热设计。
  • VCE(sat) 低(约 100 mV),在开关应用中可降低功率损耗并提高逻辑电平兼容性,特别适合与低电压数字输入接口配合使用。
  • 输出最大连续电流 50 mA,适合驱动一般的逻辑负载,但若驱动更大负载需在器件热限与安全工作区内评估。

四、典型应用场景

  • 隔离型数据信号传输(微控制器与高压电路间的接口隔离)
  • 开关电源反馈与隔离监控
  • 工业自动化中的光、电隔离输入/输出模块
  • 需要高隔离耐压的测控系统与医疗设备(应满足额外医疗安全认证时再确认)
  • 低电压逻辑电平开关及继电器驱动预驱动电路(在负载电流允许范围内)

五、封装与安装建议

  • SMD-4 表面贴装封装,适配自动贴片与回流焊工艺。焊接时请遵循制造商推荐的回流温度曲线以避免封装与内部材料应力损伤。
  • 在 PCB 布局上,输入侧与输出侧应保持适当的爬电距离和绝缘间隙,以发挥 5.3 kVrms 隔离能力;对于高压侧可增加隔离槽或提高爬电路径以增强安全裕度。
  • 建议在 PCB 设计中为输出集电极预留散热通道与合理铜厚,以便散发器件功耗,尤其在输出电流接近 50 mA 或环境温度较高时。

六、可靠性与使用注意

  • 器件工作温度范围宽(-55 ℃ 至 +110 ℃),但长期在极端高温下工作会影响寿命与 CTR 稳定性,设计时应保证足够热裕度。
  • 光耦对静电敏感,储存与装配过程应采取防静电措施。
  • 避免在 LED 或输出晶体管反向电压超过规定 Vr 时施加反向电压,以防损伤。
  • 在高湿或腐蚀环境中使用时,需注意封装可靠性及可能的绝缘劣化,必要时采取额外防护(如涂覆或密封)。

七、选型与替代建议

在选型时,应根据实际的输入驱动电流、期望的输出电流与 CTR 下限、工作电压与温度条件选择适配余量。若需要更高 CTR、更小封装或双通道版本,可向供应商咨询相近型号或在 ISOCOM 产品系列中查找替代件。同时建议获取完整数据手册与可靠性测试报告,以便完成最终设计评估。

如需样品、封装尺寸图或典型特性曲线(CTR-If、VCE-IC 等)可进一步提供,我可协助整理关键参数以便快速完成电路设计与验证。

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