Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLP521-4XGB 是一种高性能的光耦合器,专为隔离和信号传输的需求而设计,广泛应用于工业控制、电力电子设备及各种需要电气隔离的电子系统中。其独特的设计和卓越的参数使其成为在复杂环境中工作的理想选择。
TLP521-4XGB 特点如下:
通道数:本产品采用4通道设计,能够在单一封装中实现多路信号的隔离与传输,极大地优化了电路设计,提高了系统的集成度。
电压隔离:该光耦具备高达5300Vrms的电压隔离能力,确保在高压环境下的安全运行,保护后端电路安全,避免因电气故障导致的设备损坏。
电流传输比:对于5mA的输入电流,该光耦的最小电流传输比达到了100%,而最大传输比可高达600%。这样的特性保证了在不同工作条件下信号的稳定与可靠传输。
上升/下降时间:TLP521-4XGB 的典型上升时间为4µs,下降时间为3µs,响应速度快,适合对速度有较高要求的应用场景。
输入输出:光耦的输入类型为直流(DC),输出采用晶体管形式,这种设计不仅提高了信号的稳定性,还增强了对外部噪音的抵抗能力。
输出电压/电流:最大输出电压可达到55V,而最大正向电流(If)为50mA,更宽的电流和电压规格使得该光耦适用于多种不同的负载条件。
饱和压降和热特性:Vce饱和压降最高为400mV,工作温度范围在-30°C至100°C之间,使其在恶劣环境下也能稳定工作。
封装及安装类型:该产品采用16-DIP(双列直插式)封装,便于在电路板上安装,满足大多数电子设备的设计需求。DIP封装的特点使得原型设计和量产都更加方便。
TLP521-4XGB 的广泛适用性使其成为多种应用中的重要组成部分,以下是一些典型应用场景:
工业自动化:用于传感器信号的隔离与传输,提高整个自动化控制系统的安全性。
电源管理系统:在电源开关、电机控制等领域中,作为信号传递的关键元件,引导工作状态的监控及控制。
通信设备:在通信模块中,通过光耦实现高效的信号隔离,确保通讯的稳定。
医疗设备:在医疗电子设备中,保障患者和设备的电气安全,通过光耦进行生物信号的隔离处理。
汽车电子:在汽车电子系统中,使用光耦实现对高压系统的安全隔离,提升电气系统的可靠性。
TLP521-4XGB 是一款具有卓越性能的四通道光耦合器,凭借其高电压隔离能力、快速响应时间和优越的电流传输特性,成为工业控制、通信设备及各种高可靠性电子应用中不可或缺的元件。无论是用于新产品开发还是现有系统的升级,TLP521-4XGB 均能为设计师提供灵活性与安全性,是现代电子设计中的理想选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products