Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics SMAJ33A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic SMAJ33A
- Type
- Jingdao Microelectronics
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- SMAJ33A
- Electronic Component
- 1
- Package
- SMA
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.12g
- Electronic Component
- 1
- Electronic Component
- BM0226520256
- Operating Temperature
- 65℃~+150℃
- Voltage
- 53.3V
- Current(Ir)
- 1uA
- Voltage(VBR)
- 40.6V
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMAJ33A CM（SMA封装）产品概述
一、产品简介
SMAJ33A CM 是晶导微电子推出的一款高能量瞬态电压抑制器（TVS）二极管，采用SMA封装，面向需要对脉冲浪涌、线路雷击和ESD进行保护的中/高能量工业与车规电子应用。器件为单向抑制型设计，响应快速、能量吸收能力强，适合用于33V额定工作电压的直流电源与信号线上。
二、主要参数
- 钳位电压（Vc）：53.3 V
- 额定工作温度范围：-65 ℃ ~ +150 ℃
- 击穿电压（Vbr）：40.6 V
- 反向截止电压 Vrwm（稳压电压/驻波电压）：33 V
- 峰值脉冲功率 Ppp：400 W（10/1000 µs 波形）
- 峰值脉冲电流 Ipp：7.5 A（10/1000 µs 波形）
- 反向漏电流 Ir：1 µA（在 Vrwm 条件下）
- 类型：TVS 二极管（单向）
- 封装：SMA（表面贴装）
三、典型应用场景
- 24V/28V/33V 工业电源与负载保护
- 电机驱动控制器、PLC、电源模块输入端浪涌抑制
- 通信接口、接口板和配电模块的浪涌与雷击防护
- 汽车电子辅助电源（需确认车规认证与对应车型要求）
- UPS、逆变器和仪表的瞬态抑制
四、封装与安装建议
- SMA 表面贴装形式，焊盘设计应留足敷铜面积以利于散热与浪涌能量耗散。
- 器件应尽量靠近被保护节点或接口放置，走线尽量短、粗，减小感性寄生。
- 回流焊时遵循无铅回流曲线及厂商推荐的峰值温度和持续时间，避免反复长时间高温。
- 对于高能量抑制场合，可在器件两侧增加热扩散铜箔或散热垫以提高功率承受能力。
五、可靠性与注意事项
- 在长期运作中应关注器件在重复浪涌下的热循环与累积损伤；对于频繁浪涌场合需评估寿命与冗余设计。
- 漏电流随温度升高而增加，应用在高温环境时需检查静态功耗与偏置影响。
- 选型时确认单向/双向需求、实际浪涌波形（10/1000 µs 典型工业雷击）与系统能量匹配，必要时并联或选用更高功率等级器件。
- 安装与测试时注意ESD防护，避免在离散测试中发生不必要的器件损伤。
如需更详细的电气特性曲线、封装尺寸图或回流焊建议曲线，可提供器件数据手册（Datasheet）以便进一步核对与设计验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
