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Jingdao Microelectronics SMCJ26A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic SMCJ26A
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- SMCJ26A
- Electronic Component
- 1
- Package
- SMC
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.381g
- Electronic Component
- 1
- Electronic Component
- BM0229356821
- Operating Temperature
- 55℃~+150℃
- Voltage
- 42.1V
- Current(Ir)
- 1uA
- Voltage(VBR)
- 31.9V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMCJ26A 产品概述
一、特性简介
SMCJ26A（GFE，SMC/DO‑214AB封装）是晶导微电子推出的一款高能量瞬变电压抑制器（TVS二极管），针对工业与汽车类瞬态浪涌保护设计。器件额定耐受峰值脉冲功率为1.5kW（10/1000µs），在强脉冲下仍能提供可靠的浪涌吸收能力；工作温度范围宽（‑55℃至+150℃），适应恶劣环境。
二、主要参数解析
- 反向工作电压（Vrwm）：26V，适合24V供电轨的持续工作保护。
- 击穿电压（Vbr）：31.9V（典型），开始导通吸收浪涌能量。
- 钳位电压（Vc）：42.1V（在Ipp条件下），表示在峰值脉冲时对被保护线路的最大箝位电平。
- 峰值脉冲功率（Ppp）：1.5kW@10/1000µs，对应峰值脉冲电流Ipp=35.7A。由此可计算出在该工况下的等效动态阻抗约为0.29Ω（(Vc‑Vbr)/Ipp），表明器件在脉冲时具有较低的钳位阻抗。
- 反向漏电流（Ir）：1µA（在Vrwm），低漏电有利于不增加静态功耗与系统偏差。
- 类型与封装：单向TVS，SMC表面贴装（DO‑214AB），便于在PCB上贴装并承受较大热量。
三、典型应用场景
- 24V车载电气保护、通信设备的线缆入端防雷击与负载开关瞬态抑制；
- 工业控制、PLC、电源模块、逆变器和电机驱动接口的浪涌防护；
- 需要大能量脉冲吸收且对漏电流要求严格的直流电源轨保护场合。
四、封装与布局建议
SMC封装具备良好热容与导热面积，布局时建议：
- 将TVS放置于输入/连接器的最靠近端，尽量靠近受保护的线缆或引脚；
- 在器件两侧留足铜箔以提高散热能力，必要时在焊盘下方增加通孔连接底层铜层；
- 对于多线保护，单向器件用于直流线对地保护，若为交流或双向脉冲需选用对应的双向型号。
五、可靠性与使用注意
- 额定1.5kW为单次或重复脉冲能力（10/1000µs），并非连续功耗，长期稳定性需保证工作条件不出现频繁超额冲击；
- 环境温度接近+150℃时器件热应力较大，设计时应考虑散热与热循环；
- 选型时注意电压裕量：Vrwm应略高于正常工作电压，Vbr与Vc需满足系统允许的最大电压窗口。
六、选型建议与订购信息
选用SMCJ26A时，若保护对象为24V系统且需要较强的冲击吸收能力且接受单向接法，SMCJ26A为优先选择。订购信息请参考：晶导微电子 SMCJ26A（SMC/DO‑214AB 封装），如需双向或更高能量等级，可联系供应商确认相邻系列型号与可靠性测试数据。
如需我提供封装尺寸图、典型电气曲线（I‑V、钳位特性）或参考PCB布局示意，可告知将进一步补充。
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