WMSIC Electronic Components

Jingdao Microelectronics 1SMA4732A

Model1SMA4732A
PackageSMA
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic 1SMA4732A
Type
Jingdao Microelectronics
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
1SMA4732A
Electronic Component
1
Package
SMA
Electronic Component
Zener Diode
Electronic Component
0.12g
Electronic Component
1
(Zzt)
8Ω
Electronic Component
BM0229356718
Diode
1
Current(Ir)
10uA@1V
Power Dissipation(Pd)
1W
Electronic Component
4.5V~4.93V
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SMA4732A 产品概述

一、产品简介

1SMA4732A 为晶导微电子出品的独立式稳压二极管,标称稳压值 4.7V,工作结温范围宽 (-55℃ ~ +150℃),采用 SMA 封装,适用于各种要求稳压、基准和浪涌钳位的电子电路。该器件体积小、安装方便,适合表面贴装工艺(SMT)。

二、主要参数

  • 稳压值(标称):4.7V
  • 稳压值范围:4.5V ~ 4.93V
  • 反向电流(Ir):10 μA @ 1V
  • 耗散功率(Pd):1W(器件最大耗散,实际应用需考虑封装散热条件)
  • 阻抗(Zzt):8 Ω
  • 工作结温:-55℃ ~ +150℃
  • 封装形式:SMA(独立式贴片)

三、产品特点

  • 稳压精度适中:4.5V~4.93V 的稳压范围满足多数低压参考与稳压需求。
  • 低漏电流:Ir = 10 μA@1V,有利于低功耗应用中的静态电流控制。
  • 低动态阻抗:Zzt = 8 Ω,动态响应良好,有利于负载变化下维持稳压。
  • 宽温度工作范围与工业级可靠性,适合苛刻环境使用。
  • SMA 封装便于批量贴装与可靠焊接。

四、典型应用

  • 低电压参考与基准源(小信号稳压)。
  • 电源轨的局部稳压与基准补偿电路。
  • 输入浪涌与过压钳位保护(配合限流电阻使用)。
  • 通信、仪表及工业控制中的辅助电源与电压基准模块。

五、封装与可靠性

SMA 封装具备良好机械强度与焊接可靠性,适合回流焊工艺。尽管器件标称耗散 1W,但实际功率承受能力受 PCB 铜箔面积、散热通道及环境温度影响,应按热降额设计并留有裕量。

六、使用注意事项与推荐电路

  • 作为并联稳压器使用时,应接限流电阻 R:R = (Vin - Vz) / Iz,以限制通过二极管的电流并控制功耗;二极管功耗 Pd = Vz × Iz,应保证 Pd 不超过器件额定耗散并考虑温升。
  • 在高脉冲或浪涌场合,需评估能量承受能力并可外接陶瓷电容以改善瞬态响应。
  • 焊接与回流过程中注意温度曲线符合封装规范,避免超温造成性能劣化。
  • 器件极性通常以管身标记(阴极条)表示,请根据电路图正确安装。

如需器件样片参数曲线、封装尺寸图或推荐焊接工艺参数,可进一步联系供应商或查阅晶导微电子的技术文档。

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