WMSIC Electronic Components

Jingdao Microelectronics BZT52C12W

ModelBZT52C12W
PackageSOD-123
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic BZT52C12W
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
BZT52C12W
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.034g
Electronic Component
50
(Zzk)
150Ω
(Zzt)
25Ω
Electronic Component
BM0257409908
Diode
1
Current(Ir)
100nA@8V
Power Dissipation(Pd)
500mW
Electronic Component
11.4V~12.7V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C12W — 晶导微电子 12V 独立式稳压二极管(SOD-123)

一、产品概述

BZT52C12W 是晶导微电子推出的独立式稳压二极管,工作稳压值标称为 12V,实际稳压范围 11.4V ~ 12.7V,采用 SOD-123 小外形封装,适合表面贴装的低功耗基准/稳压场合。该器件以小体积、良好温度范围与低反向泄漏电流为特点,适用于便携与空间受限的电子设备。

二、主要特性

  • 标称稳压:12V(范围 11.4V ~ 12.7V)
  • 反向电流 Ir:100nA @ 8V(低泄漏)
  • 浪涌耗散功率 Pd:500mW(总耗散)
  • 稳态阻抗 Zzt:25Ω(影响小信号调节性能)
  • 工作结温度:-55℃ ~ +150℃
  • 封装:SOD-123(表面贴装)

三、典型电气参数与设计依据

稳压二极管在稳压工作点的最大允许电流 Iz_max 可由 Iz_max ≈ Pd / Vz 估算;对于 12V 等效,Iz_max ≈ 500mW / 12V ≈ 41mA。考虑封装散热及长期可靠性,推荐连续工作电流在 10–20mA 范围以降低结温并保证长期稳定性。小信号阻抗 25Ω 表明在中低电流工作区存在一定的伏差随电流变化,动态调节需配合合适的旁路与滤波。

四、功耗与热管理

SOD-123 封装的热阻较高,应关注结-环境温升。实际电路中务必计算:P = Vz × Iz(近似稳压情况下),并按环境温度和 PCB 散热能力对耗散功率进行额定降额。建议在高环境温度或长期功耗时增加散热铜箔面积或降低工作电流。

五、典型应用场景

  • 小功率参考电压源与基准
  • 便携式仪表与消费电子的局部稳压
  • 保护电路、夹位与电平参考
  • 低功耗传感器供电或偏置电路

六、使用建议与注意事项

  • 采用串联限流电阻实现稳压,计算需考虑最大浪涌与稳态耗散。
  • 在输入电压波动较大时加入输入滤波/旁路电容以改善动态响应。
  • 避免长期在 Pd 限值附近工作,推荐留有安全裕量。
  • 元件的完整性能及可靠性应以厂家完整数据手册和样品测试为准。

七、封装与订购信息

型号:BZT52C12W
品牌:晶导微电子(Jingdao)
封装:SOD-123(表面贴装)
请在选型与采购时参考晶导微电子的最新数据手册,确认波峰/回流焊工艺兼容性、湿敏等级(MSL)与可靠性测试报告。若需电路参考或热设计计算示例,可提供更详细的负载与环境条件以便给出针对性建议。

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