Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics MB10S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic MB10S
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- MB10S
- Electronic Component
- 1
- Package
- MBS
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.214g
- Electronic Component
- 1
- Electronic Component
- BM0230856395
- Current
- 800mA
- Current(Ir)
- 5uA@1000V
- (Vf)
- 1.1V@800mA
- Electronic Component
- 55℃~+150℃@(Tj)
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MB10S 产品概述
一、产品简介
MB10S 为晶导微电子推出的单相整流桥，针对中低功率、耐高压直流整流应用。其关键电气参数：整流电流 800mA（DC），正向压降 Vf = 1.1V @ 800mA（单只），非重复峰值浪涌电流 Ifsm = 30A（单次脉冲），直流反向耐压 Vr = 1kV，反向电流 Ir = 5μA @ 1000V；工作结温范围 -55℃ 至 +150℃。封装型号为 MBS，适合空间受限的电路板布置。
二、主要特点
- 低漏电流：在 1000V 时典型反向电流仅 5μA，适合高压隔离与微漏电要求场合。
- 较低正向压降：1.1V @ 800mA，使得在中等电流下功耗相对可控。
- 具备一定浪涌承受能力：30A 的非重复峰值浪涌电流允许器件承受开机或短时浪涌脉冲（仅限单次/短时）。
- 宽温度范围：-55℃~+150℃ 的结温范围提升了在极端环境下的可靠性空间。
三、典型应用
- 开关电源与线性电源的交流到直流整流输出。
- 高压直流栅极或偏置电源（需低漏电）。
- 仪器仪表与工业控制中对体积和漏电敏感的整流场合。
- 家电小功率电源、充电器前端整流（在额定条件内）。
四、设计与使用建议
- 功耗与散热：桥式整流在导通时每半周期有两只二极管串联导通，若单只 Vf = 1.1V，则桥路总压降约 2.2V。以 800mA 连续整流为例，总功耗约 1.76W，需注意 PCB 散热和周边铜箔面积或辅以散热片/通风以维持安全结温。
- 浪涌处理：Ifsm = 30A 为非重复峰值，适合短脉冲（例如充电电容的首波浪涌），但不宜用于反复高频浪涌场合；必要时增加限流或冲击吸收电路（NTC、限流电阻、缓冲电阻）。
- 反向电压裕量：Vr = 1kV 提供较大耐压裕度，但在高电压应用须考虑外部电场应力与爬电距离，并注意温度升高时 Ir 会增加。
- 降额使用：为保证长期可靠性，建议在设计中对最大电流和最大结温进行适当降额（例如长期工作电流控制在额定值的 70%~80%以内，并保证结温远低于最高限值）。
五、可靠性与采购建议
- 在批量采购前建议索取并确认完整数据手册、样品做温升与浪涌验证。
- 注意封装 MBS 的实际安装尺寸与焊接规范，确保焊点与 PCB 散热设计匹配。
- 对于关键或高可靠性应用，建议与供应商确认工艺、出货批次及可追溯性，必要时进行来料检验。
如需，我可根据您的电路工作电压、实际负载电流及环境温度，帮您计算具体功耗、预计结温及散热面积建议，或提供替代封装/参数的选型建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
