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Jingdao Microelectronics SS54C
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic SS54C
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- SS54C
- Electronic Component
- 1
- Package
- SMC(DO-214AB)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.401g
- Electronic Component
- 1
- Electronic Component
- BM0229356825
- Current
- 5A
- Diode
- Electronic Component
- Current(Ir)
- 1mA@40V
- (Vf)
- 550mV@5A
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 40V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS54C 产品概述
一. 基本概况
SS54C 是晶导微电子推出的一款独立式肖特基整流二极管，封装为 SMC（DO-214AB），针对中功率整流与开关电源应用进行了优化。该器件以较低的正向压降和快速开关特性为主要优势，适用于要求高效率和低损耗的电源回路与保护电路。
二. 主要电气参数
- 正向压降 Vf：约 550 mV（在 If = 5 A 条件下）
- 直流反向耐压 Vr：40 V
- 整流电流 If (连续)：5 A
- 反向漏电流 Ir：1 mA（在 Vr = 40 V 条件下）
以上参数表明 SS54C 在 5A 工作点下具有良好的导通性能；需注意其在高温或高反向电压下漏电流会增加，实际设计应考虑漏电特性对系统的影响。
三. 封装与热管理
SMC（DO-214AB）封装提供较好的散热路径及机械强度，适合表面贴装或焊接到具有良好散热能力的铜箔 PCB。尽管封装有利于热流散，但在 5A 等级应用中仍建议设计足够的铜箔面积或加装散热措施，以降低结温、提高可靠性。
四. 典型应用场景
- 开关电源整流与二次侧整流
- 电池充电与电源管理模块
- LED 驱动电路的整流与续流保护
- 逆向电流隔离与输入保护电路
- 工业与车载 12/24V 电源系统（在符合电压裕量条件下）
五. 选型与使用建议
- 在长期高温环境或高 Vr 条件下，需关注反向漏电流对静态功耗的影响；有必要时选用低漏电型或额定更高 Vr 的器件。
- 若需并联使用以提高电流能力，应注意电流均流问题与热耦合，建议在并联前做充分的确认测试。
- PCB 布局上，增加焊盘铜面积、采用加厚铜层或散热垫能显著改善热性能。
- 焊接与回流工艺应参照厂商资料，避免超出最大焊接温度与时间，以免影响可靠性。
六. 可靠性与资料
SS54C 作为肖特基整流器件，具有快速恢复与低正向压降的优点，但其反向漏电随温度上升增大是固有特性。建议在最终设计阶段查阅晶导微电子提供的完整数据手册，确认热阻、最大结温、回流曲线与封装机械尺寸等详细参数，以确保在目标应用中的长期可靠性和性能稳定性。
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