Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics SMAJ28CA
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic SMAJ28CA
- Type
- Jingdao Microelectronics
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- SMAJ28CA
- Electronic Component
- 1
- Package
- SMA
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.12g
- Electronic Component
- 1
- Electronic Component
- BM0226520146
- Operating Temperature
- 65℃~+150℃
- Voltage
- 45.4V
- Current(Ir)
- 1uA
- Voltage(VBR)
- 34.4V
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMAJ28CA YG（SMA 封装）TVS 二极管 — 产品概述
一、产品简介
SMAJ28CA YG 是晶导微电子推出的一款瞬态电压抑制（TVS）二极管，采用通用SMA封装，专为脉冲浪涌和静电放电保护设计。该器件针对28V工作电压范围的电源线和信号线提供快速钳位和低反向泄漏的保护能力，适用于工业电源、通信设备、服务器和一般电子系统的过压防护。
二、主要参数
- 钳位电压（Vc）：45.4V（在10/1000µs 波形、Ipp=8.8A 条件下）
- 工作温度：-65℃ ~ +150℃
- 击穿电压（Vbr）：34.4V
- 反向截止电压（Vrwm，稳态工作电压）：28V
- 峰值脉冲功率（Ppp）：400W @ 10/1000µs
- 峰值脉冲电流（Ipp）：8.8A @ 10/1000µs
- 反向电流（Ir）：1µA（在Vrwm条件下典型值）
- 封装：SMA（表面贴装）
三、关键特性与优势
- 高能量吸收：400W（10/1000µs） 能有效吸收工业级浪涌能量，保护后端电路免受瞬态冲击。
- 精准钳位：在指定脉冲下钳位电压45.4V，可将过压控制在可接受范围，降低下游元件承受应力。
- 低泄漏电流：典型反向电流仅1µA，有助于在稳态时降低功耗和热影响。
- 宽温度范围：-65℃至+150℃，适用于严苛环境与长期可靠性需求。
四、典型应用场景
- 24V/28V 工业电源防护与配电模块
- 通信设备的电源输入与接口保护（基站、路由器、交换机）
- 服务器、存储设备及外围模块的浪涌抑制
- 工业自动化、楼宇控制及仪器仪表的输入端防护
五、设计与安装建议
- 布局：将SMAJ28CA尽量靠近被保护端口放置，走线尽量短且宽以降低寄生感抗和提升散热。
- 热管理：尽管单次脉冲吸收能力强，但重复高能冲击会产生热累积，必要时配合熔断器或限流电阻使用以提升系统可靠性。
- 焊接：遵循SMA表面贴装的回流焊工艺规范，避免过高峰值温度和过长保温时间以保护器件性能。
- 选型余量：对于长期稳态运行，选用Vrwm略高于系统正常工作电压（例：24V系统选用28V级）以避免误动作；对可能出现更高浪涌的场合，考虑额外并联或级联保护策略。
六、可靠性与使用注意
器件在规定温度范围内可稳定工作；在高温与高重复脉冲条件下，应关注器件热耗散与PCB散热路径。若应用场景涉及汽车级标准或需通过特定认证，请与供应商确认是否提供相应认证（如AEC-Q101 等）。
七、总结
SMAJ28CA YG 以其400W 能量吸收能力、合理的钳位电压及低漏电特性，为28V级电源与信号接口提供可靠的瞬态过压保护。适合工业、电信及一般电子设备中需要高能量浪涌防护且空间受限的场合。选型时建议结合实际系统电压、冲击波形和重复冲击频率综合评估，并采取合理的PCB布局与热管理措施以获得最佳保护效果。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
