WMSIC Electronic Components

Jingdao Microelectronics ES2D

ModelES2D
PackageSMA
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic ES2D
Type
Jingdao Microelectronics
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
ES2D
Electronic Component
1
Package
SMA
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.12g
Electronic Component
1
Electronic Component
BM0226519468
Current
2A
Diode
1
Current(Ir)
5uA@200V
(Vf)
1V@2A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ES2D 产品概述

一、产品简介

ES2D 为晶导微电子推出的一款独立式快恢复/高效率整流二极管,采用SMA封装,面向中小功率开关电源、逆变器、充电器及一般整流应用。器件具有较低正向压降、快速反向恢复及较高浪涌承受能力,适合在-55℃至+150℃结温范围内长期工作。

二、主要特性

  • 配置:独立式二极管,便于并联或单独布板使用
  • 正向压降:Vf = 1.0 V @ If = 2 A(低导通损耗,提升效率)
  • 整流电流:IF(AV) = 2 A(连续工作能力)
  • 非重复峰值浪涌电流:IFSM = 50 A(短时冲击电流承受力强)
  • 反向耐压:VR = 200 V(高压侧保护与整流)
  • 反向电流:IR = 5 μA @ 200 V(低泄漏,有利于高阻抗电路)
  • 反向恢复时间:Trr = 35 ns(快速恢复,降低开关损耗)
  • 封装:SMA(体积小,适配自动贴装与回流焊)

三、典型应用

  • 开关电源(SMPS)整流与续流二极管
  • 车载电子电源、逆变器和电机驱动器的整流与钳位
  • 充电器、适配器的高压整流
  • 极性保护、电荷泵与保护电路中的低泄漏整流

四、电气与热特性说明

ES2D在2 A工作点时表现出较低的正向压降,可显著降低导通损耗;35 ns 的反向恢复时间使其在中高开关频率下比普通慢恢复二极管有明显效率优势。非重复峰值浪涌电流50 A能应对启动或短路浪涌,但应注意浪涌持续时间和脉形对器件应力的影响。结温范围宽,适合多场景使用,但在高结温下应考虑电流降额以保证可靠性。

五、封装与安装建议

  • 封装:SMA,适用于自动贴片工艺与回流焊接;典型PCB封装应留足焊盘面积以降低热阻。
  • 热管理:尽管SMA体积小,建议在高功率或连续2 A工作时通过增加铜箔、散热铜垫或采用散热片/散热铜层来改善散热条件。
  • 焊接工艺:推荐按照无铅回流曲线进行,避免长时间过高温度以防器件应力。

六、使用注意事项

  • 在高温环境或持续高电流工况下进行电流降额与热设计评估。
  • 对于高频开关应用,考虑反向恢复产生的电压尖峰,必要时配合RC吸收或缓冲网络降低应力。
  • 如果并联使用多颗二极管,应保证电流均分并采取合适的热设计与布线。

七、订购与质量保证

品牌:晶导微电子;型号:ES2D;封装:SMA。出货前按标准测试正向特性、反向泄漏及耐压。提供常规批量供货与技术支持,建议在选型和样机验证阶段联系供应商获取样片、完整器件数据手册和参考电路。

如需完整数据手册(含温度特性曲线、典型损耗曲线和封装尺寸图)或用于特定应用的设计建议,可提供进一步支持。

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