WMSIC Electronic Components

Jingdao Microelectronics DS34W

ModelDS34W
PackageSOD-123F
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic DS34W
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
DS34W
Electronic Component
1
Package
SOD-123F
Electronic Component
Schottky Diode
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0228055873
Current
3A
Diode
1
Current(Ir)
500uA@40V
(Vf)
550mV@3A
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DS34W 产品概述

一、产品简介

DS34W 为晶导微电子推出的一款功率肖特基整流二极管,封装为 SOD-123F,适用于中低压、高效率电源整流与功率路径保护场合。该器件具有较低的正向压降和较高的脉冲浪涌承受能力,适合对效率和热量管理有一定要求的消费电子、通信与工业控制应用。

二、主要参数

  • 正向压降 (Vf):550 mV @ 3 A
  • 直流反向耐压 (Vr):40 V
  • 最大整流电流 (If):3 A(连续)
  • 反向电流 (Ir):500 μA @ 40 V
  • 工作结温范围:-55 ℃ ~ +125 ℃
  • 非重复峰值浪涌电流 (Ifsm):80 A(非重复)
  • 封装:SOD-123F
  • 品牌:晶导微电子

三、主要特点

  • 低正向压降:在大电流条件下 Vf ≈ 0.55 V,可显著降低整流损耗,提高电源效率。
  • 适用中等电压场景:40 V 的反向耐压适配常见 12 V、24 V 供电系统以及低压 DC-DC 输出整流。
  • 较强的浪涌承受能力:80 A 非重复峰值浪涌,适合启动时的瞬态冲击或短时负载突增。
  • 小型封装:SOD-123F 兼顾体积与组装密度,适合表面贴装工艺。

四、典型应用

  • 开关电源输出整流与续流二极管
  • 电源路径/反接保护(对反向漏电流要求不高的场合)
  • 车载电子(24 V 较低电压段)、电池管理与充电系统
  • 通信设备与消费类电子中的低压功率整流

五、热与电气使用建议

  • 功率损耗示例:在 3 A 条件下 P = Vf × I ≈ 0.55 V × 3 A = 1.65 W,SOD-123F 封装散热能力有限,应通过 PCB 大铜箔区域(热沉)来降低结温。
  • 反向泄漏随温度上升显著增加,需在高温工作环境中评估 Ir 对系统待机或漏电要求的影响。
  • 对于频繁的脉冲或高平均功率工作,应适当降额使用或选用更大散热能力的封装。
  • 非重复浪涌 80 A 可应对瞬时冲击,但不可作为连续过载使用;浪涌时长与能量需参考应用场景并留有裕量。

六、可靠性与选型提示

  • 若系统对漏电流敏感(如高阻抗检测、超低功耗待机),应考虑漏电更低的器件或增加并联/电路补偿措施。
  • 若工作电流长期接近 3 A,应优先评估 PCB 热设计与环境温度,必要时选择更大封装或并联多颗器件。
  • 在 24 V 以上或更苛刻电压应力场合,建议选择更高 Vr 等级的肖特基器件。

晶导微电子 DS34W 在小体积与中等功率需求中提供了良好的效率与浪涌耐受能力,适合追求成本与性能平衡的多种电源与保护应用。选择时请结合实际热设计与漏电容忍度进行评估。

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