WMSIC Electronic Components

Jingdao Microelectronics B0520WS

ModelB0520WS
PackageSOD-323
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic B0520WS
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
B0520WS
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0229356797
Current
500mA
Diode
Electronic Component
Current(Ir)
250uA@20V
(Vf)
390mV@500mA
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B0520WS 产品概述

一、产品简介

B0520WS 是晶导微电子出品的一款独立式肖特基(Schottky)二极管,封装为 SOD-323。该器件以低正向压降和紧凑体积为特点,专为需降低导通损耗、提升效率的低电压、小电流应用场景设计。典型参数表明在 500mA 工作电流下正向压降仅约 390mV,适合便携设备和电源管理中的低损耗整流与保护用途。

二、主要电气参数

  • 正向压降 Vf:390 mV @ IF = 500 mA
  • 直流反向耐压 Vr:20 V
  • 最大整流电流 IF(连续):500 mA
  • 反向漏电流 IR:250 μA @ VR = 20 V
  • 工作结温范围:-55℃ ~ +125℃
  • 非重复峰值浪涌电流 IFSM:22 A

三、核心特性与优势

  • 低正向压降:降低功耗和发热,提升电源效率,尤其在低压差应用中优势明显。
  • 快速响应:肖特基结构具备极低的反向恢复时间,适合高频整流与开关电源的自由轮回路径。
  • 紧凑封装:SOD-323 小体积方便在空间受限的 PCB 上布局,适合小型化产品。
  • 宽温度范围:-55℃ 至 +125℃ 的结温适应工业级环境。
  • 良好的浪涌能力:22A 的峰值冲击能力能承受短时突发电流。

四、典型应用场景

  • 便携式电源与移动设备的低压整流与反向保护;
  • DC-DC 降压/升压转换器的输出整流与回路保护;
  • 电池管理与充放电路径中的方向控制与防反接;
  • LED 驱动、传感器电路及一般低电流电源轨保护;
  • 高频开关电源和混合信号电路中的快速整流。

五、封装与可靠性要点

SOD-323 为常见的表面贴装封装,适合自动化贴装工艺。由于封装体积小,器件的散热能力受限,长期满载工作时需关注 PCB 热管理与周围器件热源。器件本身在工业温度范围内可长期工作,但建议在靠近额定极限时采取适当降额策略以延长寿命。

六、使用建议与注意事项

  • 在接近 500mA 连续工作或高环境温下,应进行热仿真与实际测量,必要时采用过热保护或分流策略;
  • 对于需极低反向漏电的应用(如高阻输入或计量电路),应评估 250 μA 的 IR 是否满足系统要求;
  • 采用标准回流焊工艺时,请参照制造商数据手册中的温度曲线与焊接指南以防封装损伤;
  • 布局时确保良好的热路径,若条件允许可在铜箔处增加散热面积。

七、选型总结

B0520WS 适合追求低压降、体积小且工作电流在数百毫安量级的设计场景。其 20V 的反向耐压范围覆盖多数低压电源与保护用途;若应用需要更高耐压或更低漏电,可考虑同系列或替代产品进行比较。总体而言,B0520WS 在效率、响应速度与空间利用上具有明显优势,适合移动与工业类低功耗电路的整流与保护需求。

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