Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics BZT52C5V1SW
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic BZT52C5V1SW
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- BZT52C5V1SW
- Electronic Component
- 1
- Package
- SOD-323W
- Electronic Component
- Zener Diode
- Electronic Component
- 0.025g
- Electronic Component
- 1
- (Zzk)
- 480Ω
- (Zzt)
- 60Ω
- Electronic Component
- BM0253831389
- Diode
- 1
- Current(Ir)
- 2uA@2V
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 4.8V~5.4V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C5V1SW 产品概述
一、主要规格
BZT52C5V1SW 是晶导微电子推出的小功率稳压二极管，标称稳压值 5.1V，允许稳压范围 4.8V–5.4V。反向漏电流 Ir = 2µA（在 Vr=2V 时测得）。最大耗散功率 Pd = 200mW。交流小信号阻抗 Zzt = 60Ω，拐点/膝区阻抗 Zzk = 480Ω。封装为 SOD-323W（小型表贴）。
二、参数含义与电性能要点
- 稳压范围 4.8–5.4V 表示在指定工作电流范围内器件的最低和最高稳压极限，应按最坏情况设计。
- Ir = 2µA 指在低电压时的反向泄漏，表示静态漏流很小，适合低功耗电路。
- Zzt（动态阻抗）越小，稳压随电流变化越稳定；60Ω 表明在工作区仍有一定电压随电流变化的斜率。Zzk（膝区高阻抗）较大，意味着在靠近击穿起始电流时电压不稳定，应避免长期在该区工作。
- Pd=200mW 是在推荐散热条件下器件允许的最大耗散，理论最大稳压电流 Iz,max ≈ Pd/Vz ≈ 0.2W/5.1V ≈ 39mA。但受封装和 PCB 散热限制，实际连续工作电流应远低于该值以保证可靠性。
三、典型应用
- 低功耗稳压参考（小电流应用）
- 串联限流的简单 5.1V 参考源或电源预稳压
- 过压/浪涌钳位、信号线保护（能量不大的瞬态）
- 电平移位与偏置网络
四、使用建议与计算示例
稳压二极管需串联限流电阻 R：R = (Vin − Vz) / Iz；电阻耗散 P_R = (Vin − Vz)·Iz。
示例：Vin=12V，目标 Iz=5mA，则 R=(12−5.1)/5mA≈1.38kΩ，电阻功耗≈34.5mW，器件功耗≈5.1V×5mA=25.5mW，均远低于 Pd。建议连续工作电流通常选为 Pd/Vz 的 20–30%（例如 8–12mA 范围）以延长寿命并允许周边温升余量。
注意动态阻抗带来的电压漂移：ΔV ≈ Z · ΔI。若工作点 Iz=5mA，电流波动 ±2mA，则电压波动约 ±(60Ω×2mA)=±0.12V。
五、封装与焊接注意事项
SOD-323W 为超小型表贴封装，适合自动贴装与回流焊工艺。注意焊盘与 PCB 铜箔面积会影响散热性能，热阻较大时需降低连续工作电流并考虑在周围增加铜面以改善散热。器件通常以负极（阴极）端标识的带状标记区分极性。
六、可靠性与温度影响
稳压电压随温度有一定温度系数（随型号与工艺不同），对温度敏感度要求高的应用应查完整数据手册并做温漂评估。高环境温度或受限散热时应按 Pd 的温度降额曲线调整最大允许电流。
总结：BZT52C5V1SW 适合于体积受限、低功耗的 5.1V 基本稳压与钳位场合；设计时重点考虑串联限流、动态阻抗和封装散热限制，以保证稳压精度与长期可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
