WMSIC Electronic Components

Jingdao Microelectronics 1SMA4760A

Model1SMA4760A
PackageSMA
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic 1SMA4760A
Type
Jingdao Microelectronics
Minimum package
5000

Technical parameters

Electronic Component
Electronic
Electronic Component
1SMA4760A
Electronic Component
1
Package
SMA
Electronic Component
Zener Diode
Electronic Component
0.062g
Electronic Component
10
(Zzt)
150Ω
Electronic Component
BM0231086998
Diode
1
Current(Ir)
1uA@52V
Power Dissipation(Pd)
1W
Electronic Component
64.6V~71.7V
Electronic Component
55℃~+150℃
Electronic Component
5000
Electronic Component
68V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SMA4760A 产品概述

一、主要特点

1SMA4760A 为晶导微电子出品的独立式稳压二极管,采用 SMA 封装,适合表面贴装工艺。器件标称稳压值为 68V,稳压值允许范围为 64.6V ~ 71.7V。器件在 52V 反向电压下反向电流仅为 1 μA,动态阻抗 Zzt 为 150 Ω,额定耗散功率为 1W,结温工作范围为 -55℃ ~ +150℃。该器件适用于高压稳压、浪涌钳位与电压保护等场合。

二、主要参数解读

  • 稳压值(标称):68V,表示在规定测试条件下器件维持的目标稳压等级。稳压值范围 64.6V ~ 71.7V 表明批次与温度等因素导致的允许偏差。
  • 反向电流 Ir:1 μA @ 52V,表明在较低电压下的漏电特性,适用于要求低漏电的高压电路。
  • 动态阻抗 Zzt:150 Ω,反映稳压区对电流变化的响应,Zzt 越小稳压性能越好;150 Ω 为中等值,适合低电流稳压或作为保护件使用。
  • 耗散功率 Pd:1W,为器件在良好散热条件下可持续耗散的功率。实际应用中需考虑 PCB 散热与环境温度进行功率降额。
  • 工作结温:-55℃ ~ +150℃,适应宽温区工业级与军工级温度要求。

三、封装与引脚

1SMA4760A 采用 SMA(DO-214AC)表面贴装封装,体积小、适合自动化贴装。二极管极性用端带或标记区分,带端通常为阴极。安装时注意极性方向与焊盘设计匹配,建议参考厂商提供的推荐 PCB 尺寸与焊盘图。

四、典型应用场景

  • 高压稳压参考:需在中小电流条件下提供 ~68V 稳压参考的电路。
  • 电源浪涌钳位与过压保护:用于钳制瞬态过压,保护后级敏感器件(需参照浪涌能量参数)。
  • 通信与基站设备:48V 系统或其它高压总线的局部保护与稳压应用。
  • 工业控制与测试设备:在高压测试或监控电路中作为保护或限压元件。

五、设计与使用注意事项

  • 功率降额:1W 为在规定环境与散热条件下的额定耗散。若工作在高环境温度或无良好散热的 PCB 上,应按厂商热特性曲线进行降额(常见做法为随温度上升线性降低可持续耗散功率)。
  • 串联限流:在作为稳压源使用时,应加串联限流电阻或采用电流源驱动,以控制通过二极管的电流不超过安全值。
  • 浪涌能力:若用于浪涌保护,应参考完整数据手册中的脉冲浪涌能力与峰值电流参数,必要时选用额定更高的 TVS/瞬态抑制器。
  • 焊接工艺:遵循 SMA 封装的回流焊温度曲线,避免超温或长时间加热导致器件性能退化。
  • 极性与标识:安装时确认阴极标记方向,以免因极性接反导致功能失效或损坏。

六、选型与可靠性建议

在系统设计中如需更低动态阻抗、更高功率或更强浪涌能力,可参考同系列或更高功率封装的稳压/TVS 器件。对于对漏电极其敏感的应用,应确认在目标工作电压下的反向电流特性满足需求。批量采购时建议索取厂商完整数据手册与样品进行环境与长期可靠性验证。

备注:以上参数基于晶导微电子 1SMA4760A 基本规格。如需更详细的测试条件(如测试电流、浪涌脉冲参数、温度系数等)和 PCB 推荐封装图,请参考原厂完整数据手册或联系厂商技术支持。

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