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Jingdao Microelectronics SS86C
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic SS86C
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- SS86C
- Electronic Component
- 1
- Package
- SMC
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.381g
- Electronic Component
- 1
- Electronic Component
- BM0230630729
- Current
- 8A
- Diode
- 1
- Current(Ir)
- 1mA@60V
- (Vf)
- 700mV@8A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS86C 产品概述
晶导微电子 SS86C 是一款面向中功率整流与保护应用的肖特基二极管，采用 SMC 表面贴装封装，设计以低正向压降、较大整流电流和耐冲击能力为主，适用于开关电源和功率转换场合。
一、主要参数
- 正向压降 (Vf)：700 mV @ 8 A
- 直流反向耐压 (Vr)：60 V
- 连续整流电流 (Io)：8 A
- 反向漏电流 (Ir)：1 mA @ 60 V
- 非重复峰值浪涌电流 (Ifsm)：150 A（单次脉冲）
- 工作结温范围：-55 ℃ ～ +150 ℃
- 封装：SMC（适配大电流散热）
二、产品特点
- 低正向压降：700 mV @ 8 A，在高电流工况下可显著降低整流损耗，提高转换效率。
- 较高整流能力：8 A 连续电流适合中等功率整流和续流场合。
- 强抗冲击：150 A 的峰值浪涌能力满足启动浪涌或短时过载要求。
- 宽温度范围：-55 ℃ 至 +150 ℃ 的结温范围，适应工业级环境。
- 封装可靠：SMC 封装便于 PCB 散热和自动化贴装。
三、典型应用场景
- 开关电源整流输出与同步整流替代件。
- 电机驱动、逆变器的续流二极管。
- 汽车电子的电源保护与整流（需注意温度与漏电流随温升的影响）。
- DC-DC 转换器、充电器输出整流及输入反向保护。
- 其他需大电流、低压降且要求抗浪涌的电源模块。
四、热管理与可靠性注意
- 虽为肖特基结构，但反向漏电流在高温下会显著增加，设计时应考虑漏电随温度的上升并进行余量评估。
- SMC 封装需配合足够铜箔散热区域（热匣及过孔）以降低结温，推荐在 PCB 上设计大面积散热铜箔及必要的散热通道。
- 浪涌规格为非重复峰值，若存在重复冲击或长时间高脉冲环境，应选择更高等级或并联/保护措施。
- 建议在实际应用中做热仿真与温升测试，确认器件在最大工作电流下的结温低于额定上限。
五、选型与使用建议
- 如需更低正向压降或更大电流容量，可考虑并联多只器件，但需注意电流分配与热一致性。
- 在高环境温度或高工作电压（接近 60 V）场合，应评估反向漏电流对系统的影响并适当留有裕量。
- 设计保护电路（如熔丝、TVS 或限流）以防止长时过流导致器件过热失效。
- 焊接时遵循 SMC 封装的回流曲线，避免过热影响焊点可靠性。
六、包装与订购信息
- 品牌：晶导微电子
- 型号：SS86C
- 封装：SMC（适合自动贴装与波峰/回流焊工艺）
- 订购时请确认批次资料与完整典型曲线（Vf-T、Ir-T 等），以便在不同温度与频率工况下进行准确评估。
如需器件的典型 IV 曲线、封装外形尺寸图或在特定应用（例如 12 V/24 V 电源输出、峰值浪涌条件）的热仿真建议，我可以进一步提供更详细的设计参考。
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