WMSIC Electronic Components

Jingdao Microelectronics DS32W

ModelDS32W
PackageSOD-123FL
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
Electronic DS32W
Type
Jingdao Microelectronics
Minimum package
3000

Technical parameters

Electronic Component
Electronic
Electronic Component
DS32W
Electronic Component
1
Package
SOD-123FL
Electronic Component
Schottky Diode
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0256978395
Current
3A
Diode
1
Current(Ir)
500uA@20V
(Vf)
550mV@3A
Electronic Component
55℃~+125℃
Electronic Component
3000
Voltage Rating(Vr)
20V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DS32W 产品概述

一、产品简介

DS32W 是晶导微电子推出的一款高性能肖特基整流二极管,面向中低压、大电流的整流与保护应用。该器件在典型工作点 3A 电流下正向压降仅为 550mV,反向耐压为 20V,反向漏电流 500μA(@20V),工作结温范围宽(-55℃ 至 +125℃),封装为 SOD-123FL,兼顾小型化与热性能。

二、主要特性

  • 低正向压降:Vf = 0.55V @ IF = 3A,降低导通损耗,提高整体效率。
  • 中等反向耐压:Vr = 20V,适用于低压电源与电池系统。
  • 可观的整流能力:连续整流电流 3A,适合多种开关电源输出与功率管理场合。
  • 反向漏电较小:Ir = 500μA @ 20V,适合对待机功耗有一定要求的电路。
  • 宽温工作范围:-55℃ 至 +125℃,适应工业级环境。

三、典型电气参数(关键项)

  • 正向压降:550mV @ IF = 3A
  • 反向耐压:20V
  • 连续整流电流:3A
  • 反向漏电流:500μA @ VR = 20V
  • 工作结温:-55℃ ~ +125℃
    注:在最大电流工况下器件功耗 Pd ≈ Vf×IF = 0.55V×3A ≈ 1.65W,应考虑 PCB 散热设计与热沉配置。

四、主要应用

  • 开关电源输出二极管(低压整流)
  • 便携式设备与电池供电系统的反向极性保护
  • DC-DC 降压、升压转换器的续流/钳位二极管
  • LED 驱动、电源管理模块及小功率充电器
  • 汽车电子(低压回路)、工业控制电路等需要稳健整流与保护的场合

五、封装与热管理

SOD-123FL 封装体积小、引脚热阻较低,适合表面贴装自动化生产。尽管封装小巧,但在 3A 连续工作时需做好 PCB 散热设计:建议加宽焊盘、增加铜箔面积或在底层做热过孔以提升散热;在高环境温度或散热受限时应适当降额使用。

六、使用建议与注意事项

  • 考虑热耗:在最大工作电流下器件会产生约 1.65W 热量,长期高温会增加正向压降与反向漏电,设计时应预留热裕量并考虑降额。
  • 反向漏电特性随温度上升而增大,若应用对待机漏电敏感,应进行温度下的测试验证。
  • 推荐采用符合工业标准的无铅回流焊工艺进行贴装,避免超过器件允许的峰值回流温度规范。
  • 储存与封装注意防潮,长期存放建议按元件防潮等级管理并在规定时间内回流焊接。

七、可靠性与质量控制

晶导微电子对器件的工艺控制与测试流程严格把关,出厂前通常经过电气参数筛选与外观检查。建议在量产前进行样片测试与环境应力测试(如温度循环、湿热等),以确保在目标系统中的长期可靠性。

八、结论与采购信息

DS32W 以其低正向压降、3A 连续整流能力及小型 SOD-123FL 封装,适合各类低压高效整流与保护应用。若需样片、详细封装尺寸图、回流曲线或批量采购信息,请联系晶导微电子授权渠道获取完整数据手册与技术支持。

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