WMSIC Electronic Components

Jingdao Microelectronics UM10B

ModelUM10B
PackageUMB
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic UM10B
Type
Jingdao Microelectronics
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
UM10B
Electronic Component
1
Package
UMB
Type
Electronic Component
Electronic Component
Bridge Rectifier
Electronic Component
0.113g
Electronic Component
1
Electronic Component
BM0230630454
Current
800mA
Current(Ir)
3uA@1000V
(Vf)
1.1V@800mA
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

UM10B 产品概述

一、产品简介

UM10B 是晶导微电子推出的一款单相整流桥,面向中低功率、高电压整流场景。其典型正向压降为 1.1V(在 800mA 条件下),直流反向耐压达 1000V,直流整流电流 800mA,反向漏电流仅 3µA(@1000V),且能够承受 25A 的非重复峰值浪涌电流 (Ifsm)。工作结温范围宽广,为 -55℃ 至 +150℃,适应多种工业环境。

二、主要特性

  • 高耐压:Vr = 1000V,适用于高电压整流与保护场合。
  • 低正向压降:Vf = 1.1V @ 800mA,有利于降低整流损耗与发热。
  • 低漏电流:Ir = 3µA @ 1000V,提高高压下的静态效率与可靠性。
  • 良好浪涌能力:Ifsm = 25A,可应对启动或短时冲击电流。
  • 宽温范围:-55℃ ~ +150℃,满足恶劣环境要求。
  • 紧凑封装:UMB 封装,利于表面贴装与空间受限设计。

三、典型应用

  • 开关电源与适配器的高压整流段。
  • 工业控制与测量设备的交流整流。
  • 小功率电机驱动、灯具驱动、家电电子模块。
  • 太阳能逆变器/充电器中高压整流或保护电路。
  • 需要低漏电或高耐压的特殊电子场合。

四、设计与热管理建议

  • 连续 800mA 工作时需关注结温上升,建议在 PCB 上使用较大铜箔散热沟道并靠近焊盘散热。
  • 高频开关场合请注意开关损耗及电磁兼容,必要时并联限流或RC 抑制。
  • 在高温环境下考虑电流降额,确保 Tj 不超过规格上限并保持足够安全余量。
  • 焊接及回流工艺请参照厂家 Datasheet,避免超出封装允许的温度和时间曲线。

五、选型与采购建议

选用 UM10B 时,请确认系统最大反向电压、工作电流及瞬态浪涌是否在器件额定范围内。对于更高连续电流需求,可考虑并联或选择更大额定值器件。采购前建议向晶导微电子索取最新 Datasheet、封装尺寸图与可靠性测试报告,确认是否满足环境与法规(如需要 RoHS/REACH 证明,请咨询厂家)。

如需参考电路图、封装尺寸或样片测试结果,我可以帮助整理关键参数和典型应用电路。

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