WMSIC Electronic Components

Jingdao Microelectronics MM1Z5V1W

ModelMM1Z5V1W
PackageSOD-123W
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic MM1Z5V1W
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
MM1Z5V1W
Electronic Component
1
Package
SOD-123W
Electronic Component
Zener Diode
Electronic Component
0g
Electronic Component
130Ω
Electronic Component
50
Electronic Component
BM0234450581
Diode
Electronic Component
Power Dissipation(Pd)
500mW
Electronic Component
4.8V~5.4V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MM1Z5V1W 5.1V 稳压二极管产品概述

一、产品简介

MM1Z5V1W 是晶导微电子推出的一款独立式稳压二极管(齐纳二极管),标称稳压值为 5.1V,适用于各种低功耗稳压和电压基准场合。器件以 SOD-123W 表面贴装封装提供,体积小、便于自动贴装与批量生产。

二、主要参数

  • 稳压值(标称):5.1V
  • 稳压值范围:4.8V ~ 5.4V
  • 反向电流 Ir:2 μA @ 1.5V(推荐按规格表确认测试条件)
  • 耗散功率 Pd:500 mW
  • 动态阻抗(阻抗):约 130 Ω
  • 配置:独立式(独立稳压二极管)
  • 封装:SOD-123W
  • 品牌:晶导微电子

三、特点与性能

  • 稳压精度适中,标称 5.1V、范围 4.8–5.4V,适合对电压精度要求不高的电路。
  • 低反向漏电(2 μA @1.5V),适用于对静态电流敏感的便携或低功耗设备。
  • 500 mW 的耗散能力在小功率稳压与保护场合足够使用,但需注意散热与功率分配。
  • 约 130 Ω 的阻抗表明在小电流变化下电压有一定漂移,适合作为参考电压或低功耗箝位器件,而非高精度基准源。

四、典型应用

  • 小功率电源的并联稳压或电压箝位
  • 电路保护与浪涌限制(低能量脉冲)
  • 参考电压源(对精度要求不高的场合)
  • 便携设备、传感器模块及消费类电子的本地稳压

五、使用建议与注意事项

  • 功率与电流计算:在理想情况下最大齐纳电流可按 Iz_max = Pd / Vz 估算,约为 0.5W / 5.1V ≈ 98 mA。但实际使用时应考虑封装散热和器件寿命,通常建议工作电流为几毫安到数十毫安范围,视散热条件而定。
  • 热管理:SOD-123W 封装散热受限,长时间接近额定功耗会导致结温升高,需在电路设计中留有裕量并合理布线散热。
  • 器件选型:若需更高稳压精度或更大功率,应选择相应型号或搭配稳压芯片。
  • 安装与可靠性:推荐按厂商回流焊工艺规范处理,避免超出封装耐受的温度和时间。存储与操作时注意防静电与潮湿防护。

六、封装与订购信息

  • 型号:MM1Z5V1W(4N)
  • 封装:SOD-123W,适合表面贴装生产线
  • 品牌:晶导微电子

以上为 MM1Z5V1W 的产品概述,适用于需要小型、低功耗稳压或电压箝位的电子设计场合。设计时请参考完整型号数据手册以获取详尽的试验条件与温度特性曲线。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.