WMSIC Electronic Components

Jingdao Microelectronics BAV70

ModelBAV70
PackageSOT-23
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic BAV70
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
BAV70
Electronic Component
1
Package
SOT-23
Electronic Component
Switch Diode
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0265390941
Current
200mA
Diode
1
Current(Ir)
2.5uA@70V
(Vf)
1.25V@150mA
Power Dissipation(Pd)
225mW
Electronic Component
55℃~+150℃@(Tj)
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAV70开关二极管产品概述

BAV70是晶导微电子推出的1对共阴极高速开关二极管,采用SOT-23小型表面贴装封装,以低正向压降、高速反向恢复、宽温工作范围为核心特性,广泛适配高频逻辑电路、电源保护、通信设备等场景,是小信号高速切换应用的高性价比选型。

一、产品定位与核心特性

BAV70定位于高速小信号开关二极管,区别于普通整流二极管,其核心优势集中在「快速切换能力」与「小体积集成」:

  • 集成1对共阴极二极管,单封装实现双管功能,节省PCB空间;
  • 反向恢复时间仅6ns,可满足MHz级高频信号的快速导通/关断需求;
  • 宽工作结温(-55℃~+150℃),适配工业级、汽车电子等极端环境;
  • 低正向压降(1.25V@150mA),减少导通损耗,适合低压电路设计。

二、关键参数详解

BAV70的电气与热参数均经过严格测试,核心指标覆盖实际应用的关键需求:

2.1 电气特性

参数 典型值/额定值 应用意义 正向压降(Vf) 1.25V @ 150mA 低导通损耗,降低电路发热,适配3.3V/5V低压 直流反向耐压(Vr) 70V 满足多数小信号电路的反向过压保护需求 持续整流电流(Io) 200mA 最大持续工作电流,适配中等负载场景 耗散功率(Pd) 225mW 最大允许功耗,指导电路功率设计 反向漏电流(Ir) 2.5uA @ 70V 低漏电流提升电路效率,减少静态功耗 反向恢复时间(Trr) 6ns 高速切换核心,适配高频信号(如100MHz以上)

2.2 热特性与可靠性

  • 工作结温范围:-55℃+150℃,覆盖商业级(070℃)、工业级(-40~125℃)甚至部分汽车级场景;
  • 非重复浪涌电流(Ifsm):2A(8.3ms脉冲),可承受电源上电、瞬时短路等突发过流冲击,提升电路抗干扰能力。

三、典型应用场景

BAV70的特性使其适配多种高速小信号场景,常见应用包括:

3.1 高速逻辑电路

  • TTL/CMOS电路的信号钳位:防止过冲电压损坏逻辑芯片;
  • 双路开关切换:共阴极配置可实现两路信号的同步/异步切换,如数据总线的方向控制。

3.2 高频信号处理

  • 射频前端混频器:快速导通/关断实现信号混频;
  • 通信接口ESD保护:配合其他器件实现高速数据接口(如USB、SPI)的静电防护。

3.3 电源与汽车电子

  • 低压差电源(LDO)续流二极管:减少电源纹波,提升输出稳定性;
  • 车载传感器接口:宽温范围适配汽车发动机舱(-40~125℃)的温度变化,实现传感器信号的切换与保护。

3.4 消费电子

  • 手机/平板充电电路:反向保护防止电池反接;
  • 耳机/音频接口:信号切换与噪声抑制。

四、封装与生产适配

BAV70采用SOT-23封装(尺寸约2.9mm×1.6mm×1.1mm),具有以下优势:

  • 小体积:适合高密度PCB设计(如智能手机、智能穿戴设备);
  • 表面贴装:兼容自动化贴装生产线,提升生产效率;
  • 引脚定义清晰:共阴极引脚(通常引脚1/3为阴极,引脚2为公共阳极),便于电路布线。

晶导微电子对该产品执行严格的可靠性测试,包括温度循环、湿度老化、浪涌冲击等,确保批量产品的一致性与稳定性。

五、选型参考与注意事项

在设计中选择BAV70时,需注意以下要点:

  1. 电流与功率匹配:持续电流不超过200mA,功耗不超过225mW,避免过载;
  2. 温度环境:若工作环境超过150℃,需增加散热设计;
  3. 反向恢复时间:若应用频率高于100MHz,需确认Trr是否满足需求(BAV70的6ns可覆盖多数高频场景);
  4. 共阴极配置:若需要共阳极或单管,需选择其他型号(如BAV99为共阳极)。

BAV70凭借高速、小体积、宽温等特性,成为高速小信号切换场景的主流选型之一,晶导微电子的量产能力也保障了其供应稳定性,适合批量消费电子、工业控制等领域的设计需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.