Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics 1N4004W
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic 1N4004W
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- 1N4004W
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0226518938
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 5uA@400V
- (Vf)
- 1.1V@1A
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 400V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1N4004W 产品概述
一、产品简介
1N4004W 是晶导微电子推出的一款通用整流二极管，独立式（单只）封装，适用于各种整流与保护场合。该器件在中高电压电源、开关电源前级整流以及通用功率控制电路中具有良好的性价比与可靠性。
二、主要参数
- 正向压降（Vf）：1.1 V @ 1 A（典型/指标）
- 直流反向耐压（Vr）：400 V（最大重复反向电压）
- 反向电流（Ir）：5 µA @ 400 V
- 整流电流：1 A（平均整流电流）
- 封装：SOD-123F（表面贴装，独立式）
- 品牌：晶导微电子
三、特性与优势
- 高耐压：400 V 反向耐压适合多数中高压整流应用。
- 低漏电：在高压条件下反向电流仅为微安级，利于低损耗待机设计。
- 可靠稳定：单只独立封装便于单通道布板与维修替换。
- 兼容性好：适用于传统整流、保护二极管或作为开关器件的输出整流。
四、典型应用
- 交流整流桥或单线整流电路。
- 开关电源（SMPS）输出或副边整流（视电流及开关频率选型）。
- 反向电压保护与钳位电路。
- 家电、照明及工业电源等通用电源模块。
五、封装与热管理
SOD-123F 为小型表面贴装封装，利于高密度布板。尽管平均整流电流为1 A，实际使用时需关注PCB散热路径与焊盘面积，必要时增加铜箔或散热层以降低结温，提高可靠性。
六、选型与使用建议
- 若电路工作电压接近400 V，应留有裕量并关注反向冲击与瞬态过压问题。
- 高频开关电源中需评估反向恢复特性，若对恢复时间敏感可考虑专用快恢复或肖特基型替代件。
- 焊接请参照推荐回流曲线与ESD/湿敏等级规范，保证器件性能与长期稳定。
如需器件详尽参数曲线、封装尺寸图或可靠性测试报告，可进一步索取晶导微电子提供的完整数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
