WMSIC Electronic Components

Jingdao Microelectronics SMF6.5A

ModelSMF6.5A
PackageSOD-123F
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic SMF6.5A
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
SMF6.5A
Electronic Component
1
Package
SOD-123F
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0226520303
Operating Temperature
55℃~+150℃
Voltage
11.2V
Current(Ir)
250uA
Voltage(VBR)
7.98V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF6.5A AK — TVS瞬态抑制二极管产品概述

一、产品简介

SMF6.5A AK 是晶导微电子出品的一款单向瞬态电压抑制器(TVS),采用紧凑的 SOD-123F 封装,专为对瞬态过压、浪涌和电气静电放电(ESD)提供高效保护而设计。该器件在汽车电子、通信设备、工业控制与消费电子等对线路稳压与浪涌抑制有苛刻要求的场合广泛应用。

二、主要参数

  • 钳位电压(Vc):11.2 V(在指定浪涌条件下测得)
  • 反向工作电压 Vrwm:6.5 V
  • 击穿电压(Vbr):7.98 V
  • 峰值脉冲功率 Ppp:200 W(10/1000 μs 波形)
  • 峰值脉冲电流 Ipp:17.9 A(10/1000 μs)
  • 反向漏电流 Ir:250 μA(在 Vrwm 下)
  • 极性:单向
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 类型/封装:TVS / SOD-123F

三、产品特性

  • 极低的钳位电压(11.2 V),在瞬态事件时能有效限制被保护线路电压,减少后级器件应力。
  • 高能量吸收能力(200 W@10/1000 μs),适应较长脉冲宽度的浪涌场景。
  • 单向结构适合对相对于地的正向浪涌进行保护,漏电流低、热稳定性好。
  • 宽温度范围(-55 ℃ ~ +150 ℃),满足户外、汽车及工业级应用的可靠性要求。
  • SOD-123F 小体积封装,便于在空间受限的 PCB 设计中布局。

四、典型应用

  • 汽车电源总线保护(车载模块、传感器接口)
  • 通信设备的接口与电源浪涌防护(以太网、串口、USB 辅助保护)
  • 工业控制与电源模块的输入端防护
  • 消费类电子和便携设备的过压/ESD 保护

五、使用与选型建议

  • 选型时以被保护线路的最大工作电压(Vrwm)匹配为首要条件,本器件 Vrwm=6.5 V,适用于 ~5–6 V 等级电源保护。
  • 单向 TVS 在正向冲击时工作,安装时建议将阴极(K)接被保护线,阳极(A)接地;确保方向正确以发挥保护功能。
  • 如需更高的能量吸收或不同工作电压,请选择相应额定型号或并联/串联组合时注意热与浪涌分享特性。
  • 在 PCB 布局上,建议将 TVS 放置于靠近浪涌入口(如连接器、屏蔽盒)的第一条路径,并保持较短且宽的回流路径以降低寄生感抗。

六、封装与可靠性

SOD-123F 封装体积小、焊接可靠,适配常见的 SMT 生产线。器件经过高温循环与浪涌耐受测试,能在 -55 ℃ 至 +150 ℃ 的环境下长期工作。建议遵循厂商推荐的回流焊工艺和最大应力限值以保证可靠性。

七、注意事项与储存

  • 避免在超过规定温度或潮湿环境中长期存放;按厂商建议进行干燥保存。
  • 焊接时遵循无铅回流曲线,避免重复加热导致封装应力。
  • 使用过程中如需并联多个 TVS,应考虑电流分配与热散失问题。
  • 选择与设计时考虑到后级器件允许的最大钳位电压,必要时在 TVS 前增加限流元件。

如需材料清单、封装尺寸图或更详细的浪涌曲线与典型测试波形,请告知,我可提供相应的数据手册摘录与参考电路示意。

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