WMSIC Electronic Components

Jingdao Microelectronics SMBJ13CA

ModelSMBJ13CA
PackageSMB
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic SMBJ13CA
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
SMBJ13CA
Electronic Component
1
Package
SMB
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.167g
Electronic Component
1
Cj- Capacitor
390pF
Electronic Component
BM0230630726
Voltage
21.5V
Current(Ir)
1uA
Voltage(VBR)
15.9V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMBJ13CA 产品概述

一、产品简介

SMBJ13CA(晶导微电子,封装:SMB)是一款面向12V电源和信号线的瞬态电压抑制(TVS)二极管。该器件在脉冲过电压事件中能快速钳位,保护下游电路免受高能浪涌损伤。器件以高峰值脉冲功率、低漏电流和适中的结电容为特点,适合汽车电子、工业电源、通讯接口等场景中的浪涌保护应用。

二、主要参数解读

  • 反向工作电压(Vrwm):13 V —— 建议用于标称12 V系统的持续工作电压下沿(充当稳态耐压)。
  • 击穿电压(Vz):15.9 V —— 在规定条件下开始进入雪崩导通。
  • 钳位电压(Vc):21.5 V —— 在峰值脉冲条件(Ipp)下的最大钳位电压,表示被保护节点在遭受脉冲时的最大电压幅值。
  • 峰值脉冲功率(Ppp):600 W @ 10/1000 μs —— 以10/1000 μs波形测得的瞬态能量吸收能力。
  • 峰值脉冲电流(Ipp):28 A —— 对应于上述功率与钳位条件下的脉冲电流能力。
  • 反向漏电流(Ir):1 μA —— 在Vrwm下的典型小漏电流,利于低静态功耗系统。
  • 结电容(Cj):390 pF —— 对高速信号线会产生显著影响,应在低容抗要求场合慎用。
  • 封装:SMB(中等功率表面贴装,便于自动贴装与散热)。

三、典型应用场景

  • 汽车电子(车载电源总线、车身控制模块等)—— 适合12 V供电系统的浪涌防护。
  • 工业电源与控制设备—— 对抗雷击、开关瞬态和电源接入/断开产生的尖峰。
  • 通信与网络设备的电源输入端保护。
  • 电池管理、充电器接口的过压浪涌防护(需注意结电容对信号影响)。

四、设计与选型建议

  • 选择依据:优先确认工作电压Vrwm是否高于最大正常工作电压(含纹波)且留有裕量;钳位电压应低于被保护器件可承受的最大电压。对于12 V系统,Vrwm=13 V为常见合适值,Vc=21.5 V可保证在短时浪涌下保护有效。
  • 浪涌能量匹配:若预期脉冲能量或持续时间超出10/1000 μs规范,应核算实际能量并适当增加器件冗余或并联多个器件(并联注意电流均分问题)。
  • 对高速信号:结电容390 pF值较大,会引起信号失真或带宽下降,不建议用于对高频/高速接口的直接保护(如USB3.0、HDMI等)。
  • 漏电流敏感场合:Ir=1 μA属于低漏电流,适合电源与偏置敏感电路,但在极低功耗场合仍需验证系统待机功耗影响。

五、封装与可靠性注意事项

  • SMB封装具备中等散热能力,建议在PCB布局上提供足够铜面和热沉,以利短时脉冲能量散布。
  • 本器件用于瞬态抑制,不适合长期承受高电流或长时间导通状态。连续超出额定Vrwm或频繁大能量冲击会降低寿命或导致失效。
  • 出厂与使用时请关注元件合规性(如需RoHS/REACH证明,请向供应商索取)。

六、布局与焊接建议

  • 放置位置:靠近可能入侵脉冲的连接器或线缆端口,尽量缩短连接导线长度以减小串联感抗。
  • 接地要求:若用于单端抑制,应保证器件接地端有低阻抗回流路径,采用较宽的地铜箔和多过孔过孔以降低阻抗。
  • 焊接工艺:遵循SMB封装的回流温度曲线,避免过高回流温度和重复回流,焊接后建议进行外观和焊点质量检查。

七、订购信息

  • 型号:SMBJ13CA BG
  • 品牌:晶导微电子
  • 封装:SMB
    如需样片、器件数据手册(Datasheet)、可靠性报告或符合性证明,请联系晶导微电子或其授权分销商获取完整技术资料与检测报告。

总结:SMBJ13CA在12 V级别电源保护中提供较好的瞬态抑制能力,600 W@10/1000 μs和21.5 V的钳位电压使其能应对常见的浪涌事件。选型时需综合考虑钳位、电容、漏电流和系统热处理能力,合理布局与焊接能显著提升保护效果和可靠性。

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